Memory
UPD44644092F5-E50-FQ1
Description: DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165

Overview of UPD44644092F5-E50-FQ1 by NEC Electronics Group

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Part Data Attributes for UPD44644092F5-E50-FQ1 by NEC Electronics Group

UPD44644092F5-E50-FQ1
NEC Electronics Group
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
Part Package Code
BGA
Package Description
LBGA,
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
0.45 ns
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e0
Length
17 mm
Memory Density
75497472 bit
Memory IC Type
DDR SRAM
Memory Width
9
Number of Functions
1
Number of Terminals
165
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8MX9
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.51 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
15 mm
Want to compare parts?
  1. UPD44644092F5-E50-FQ1
    NEC Electronics Group
    DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165
    VS

Alternate Parts for UPD44644092F5-E50-FQ1

This table gives cross-reference parts and alternative options found for UPD44644092F5-E50-FQ1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD44644092F5-E50-FQ1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY7C1527V18-200BZC DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-200BZC
CY7C1527V18-167BZI DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-167BZI
CY7C1527V18-167BZXI DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-167BZXI
UPD44644092F5-E50-FQ1-A DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 NEC Electronics Group UPD44644092F5-E50-FQ1 vs UPD44644092F5-E50-FQ1-A
CY7C1527V18-200BZXI DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-200BZXI
CY7C1527V18-200BZI DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-200BZI
CY7C1527V18-167BZXC DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-167BZXC
CY7C1527V18-167BZC DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-167BZC
Part Number Description Manufacturer Compare
GS8662D09BGD-200T Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology UPD44644092F5-E50-FQ1 vs GS8662D09BGD-200T
GS8662D10BGD-300 DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology UPD44644092F5-E50-FQ1 vs GS8662D10BGD-300
CY7C1526V18-167BZI QDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1526V18-167BZI
GS8662D11BD-400IT QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology UPD44644092F5-E50-FQ1 vs GS8662D11BD-400IT
GS8662T10BD-300I DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, FBGA-165 GSI Technology UPD44644092F5-E50-FQ1 vs GS8662T10BD-300I
GS8662T09E-250IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1MM PITCH, FPBGA-165 GSI Technology UPD44644092F5-E50-FQ1 vs GS8662T09E-250IT
CY7C1527V18-167BZXC DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1527V18-167BZXC
CY7C1525AV18-250BZXC QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor UPD44644092F5-E50-FQ1 vs CY7C1525AV18-250BZXC
GS8662D09GE-300T DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology UPD44644092F5-E50-FQ1 vs GS8662D09GE-300T
GS8662DT11BGD-450T QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology UPD44644092F5-E50-FQ1 vs GS8662DT11BGD-450T

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