Part Details for GS8662T10BD-300I by GSI Technology
Overview of GS8662T10BD-300I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Automotive
Price & Stock for GS8662T10BD-300I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8662T10BD-300I
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Avnet Americas | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Bulk - Bulk (Alt: GS8662T10BD-300I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$73.6464 / $90.6840 | Buy Now |
DISTI #
464-GS8662T10BD-300I
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 9 72M | 0 |
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$72.2100 / $86.1500 | Order Now |
Part Details for GS8662T10BD-300I
GS8662T10BD-300I CAD Models
GS8662T10BD-300I Part Data Attributes
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GS8662T10BD-300I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662T10BD-300I
GSI Technology
DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE, LATE WRITE | |
JESD-30 Code | R-PBGA-B165 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 9 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX9 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 13 mm |
Alternate Parts for GS8662T10BD-300I
This table gives cross-reference parts and alternative options found for GS8662T10BD-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662T10BD-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS8662D09BGD-200T | Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662T10BD-300I vs GS8662D09BGD-200T |
GS8662D10BGD-300 | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662T10BD-300I vs GS8662D10BGD-300 |
CY7C1526V18-167BZI | QDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T10BD-300I vs CY7C1526V18-167BZI |
GS8662D11BD-400IT | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662T10BD-300I vs GS8662D11BD-400IT |
GS8662T09E-250IT | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1MM PITCH, FPBGA-165 | GSI Technology | GS8662T10BD-300I vs GS8662T09E-250IT |
CY7C1527V18-167BZXC | DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T10BD-300I vs CY7C1527V18-167BZXC |
CY7C1525AV18-250BZXC | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T10BD-300I vs CY7C1525AV18-250BZXC |
GS8662D09GE-300T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662T10BD-300I vs GS8662D09GE-300T |
GS8662DT11BGD-450T | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662T10BD-300I vs GS8662DT11BGD-450T |
GS8662D10BD-300T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662T10BD-300I vs GS8662D10BD-300T |