Datasheets
UPD23C4001EJCZ-XXX by:

IC,ROM,512KX8,CMOS,DIP,32PIN,PLASTIC

Part Details for UPD23C4001EJCZ-XXX by Renesas Electronics Corporation

Overview of UPD23C4001EJCZ-XXX by Renesas Electronics Corporation

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Applications Consumer Electronics Aerospace and Defense

Part Details for UPD23C4001EJCZ-XXX

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UPD23C4001EJCZ-XXX Part Data Attributes

UPD23C4001EJCZ-XXX Renesas Electronics Corporation
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UPD23C4001EJCZ-XXX Renesas Electronics Corporation IC,ROM,512KX8,CMOS,DIP,32PIN,PLASTIC
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Memory Density 8388608 bit
Memory IC Type MASK ROM
Memory Width 16
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min -10 °C
Organization 512KX16
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.0001 A
Supply Current-Max 0.025 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

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