Microcontrollers and Processors
TSPC860MHVZP40B
Description: RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357

Overview of TSPC860MHVZP40B by Thales Group

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Part Data Attributes for TSPC860MHVZP40B by Thales Group

TSPC860MHVZP40B
Thales Group
-
-
Part Life Cycle Code
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
Part Package Code
BGA
Package Description
,
Pin Count
357
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
40 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
Low Power Mode
NO
Number of Terminals
357
Operating Temperature-Max
110 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Speed
40 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Position
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
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  1. TSPC860MHVZP40B
    Thales Group
    RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357
    VS

Alternate Parts for TSPC860MHVZP40B

This table gives cross-reference parts and alternative options found for TSPC860MHVZP40B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860MHVZP40B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
TSPC860MHVZP40B RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 Teledyne e2v TSPC860MHVZP40B vs TSPC860MHVZP40B
Part Number Description Manufacturer Compare
TS(X)PC860MHMZPU/T50C Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 Thales Group TSPC860MHVZP40B vs TS(X)PC860MHMZPU/T50C
TS(X)PC860MHVZPU40C 32-BIT, 40MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Teledyne e2v TSPC860MHVZP40B vs TS(X)PC860MHVZPU40C
MPC860DECZQ50D4 PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, -40 to 95C Freescale Semiconductor TSPC860MHVZP40B vs MPC860DECZQ50D4
TSPC860MHMGB/Q40A3 Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 Thales Group TSPC860MHVZP40B vs TSPC860MHMGB/Q40A3
TSPC860SRMZPU80B RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA357, PLASTIC, BGA-357 Atmel Corporation TSPC860MHVZP40B vs TSPC860SRMZPU80B
MPC866PZP133 32-BIT, 133MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Motorola Mobility LLC TSPC860MHVZP40B vs MPC866PZP133
MPC860TCZQ50D4 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Freescale Semiconductor TSPC860MHVZP40B vs MPC860TCZQ50D4
TSPC860MHVZP40A3 Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 Thales Group TSPC860MHVZP40B vs TSPC860MHVZP40A3
XPC860ENZP66D4 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Motorola Mobility LLC TSPC860MHVZP40B vs XPC860ENZP66D4
XPC860SRCZP50D4 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Motorola Mobility LLC TSPC860MHVZP40B vs XPC860SRCZP50D4

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