Part Details for TS(X)PC860MHVZPU40C by Teledyne e2v
Overview of TS(X)PC860MHVZPU40C by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for TS(X)PC860MHVZPU40C
TS(X)PC860MHVZPU40C CAD Models
TS(X)PC860MHVZPU40C Part Data Attributes
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TS(X)PC860MHVZPU40C
Teledyne e2v
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Datasheet
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TS(X)PC860MHVZPU40C
Teledyne e2v
32-BIT, 40MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL GRENOBLE | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| Low Power Mode | NO | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 40 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TS(X)PC860MHVZPU40C
This table gives cross-reference parts and alternative options found for TS(X)PC860MHVZPU40C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TS(X)PC860MHVZPU40C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC860SRCZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHVZPU40C vs XPC860SRCZP66D4 |
| TS(X)PC860MHMZPB/Q50A3 | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHVZPU40C vs TS(X)PC860MHMZPB/Q50A3 |
| XPC860SRZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHVZPU40C vs XPC860SRZP50D4 |
| TS(X)PC860MHMGU/T40B | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHVZPU40C vs TS(X)PC860MHMGU/T40B |
| MPC860TVR50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | TS(X)PC860MHVZPU40C vs MPC860TVR50D4 |
| TSPC860MHMGB/Q40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHVZPU40C vs TSPC860MHMGB/Q40A3 |
| MPC860DECZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | TS(X)PC860MHVZPU40C vs MPC860DECZQ50D4 |
| TS(X)PC860MHMZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TS(X)PC860MHVZPU40C vs TS(X)PC860MHMZP50B |
| MPC860TVR50D4R2 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | TS(X)PC860MHVZPU40C vs MPC860TVR50D4R2 |
| TSPC860MHVGB/Q40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHVZPU40C vs TSPC860MHVGB/Q40A3 |