Part Details for TSPC750AMGSB/Q12LH by Thales Group
Overview of TSPC750AMGSB/Q12LH by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC750AMGSB/Q12LH
TSPC750AMGSB/Q12LH CAD Models
TSPC750AMGSB/Q12LH Part Data Attributes
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TSPC750AMGSB/Q12LH
Thales Group
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Datasheet
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TSPC750AMGSB/Q12LH
Thales Group
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | CGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC750AMGSB/Q12LH
This table gives cross-reference parts and alternative options found for TSPC750AMGSB/Q12LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AMGSB/Q12LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC750AMGSB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSPC750AMGSB/Q12LH vs TSPC750AMGSB/T12LE |
| TSPC750AMGSU12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSPC750AMGSB/Q12LH vs TSPC750AMGSU12LE |
| TSPC750AVGSU/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSPC750AMGSB/Q12LH vs TSPC750AVGSU/T12LE |
| TSPC750AMGSU12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSPC750AMGSB/Q12LH vs TSPC750AMGSU12LH |
| TSPC750AMGSU12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSPC750AMGSB/Q12LH vs TSPC750AMGSU12LH |
| TSXPC750AMGSB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | TSPC750AMGSB/Q12LH vs TSXPC750AMGSB/T12LE |
| TSXPC750AMGS12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSPC750AMGSB/Q12LH vs TSXPC750AMGS12LH |
| TSPC750AMGS12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSPC750AMGSB/Q12LH vs TSPC750AMGS12LE |
| TSXPC750AMGSU12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | TSPC750AMGSB/Q12LH vs TSXPC750AMGSU12LE |
| TSPC750AMGSU12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | TSPC750AMGSB/Q12LH vs TSPC750AMGSU12LE |