Part Details for TSPC603EMGB/T3LL by Teledyne e2v
Overview of TSPC603EMGB/T3LL by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC603EMGB/T3LL
TSPC603EMGB/T3LL CAD Models
TSPC603EMGB/T3LL Part Data Attributes
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TSPC603EMGB/T3LL
Teledyne e2v
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Datasheet
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TSPC603EMGB/T3LL
Teledyne e2v
RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL GRENOBLE | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 255 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 66.67 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B255 | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Speed | 100 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC603EMGB/T3LL
This table gives cross-reference parts and alternative options found for TSPC603EMGB/T3LL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603EMGB/T3LL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC740AVGU/T12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603EMGB/T3LL vs TSPC740AVGU/T12LH |
| IBM25EMPPC603E2BB200K | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, 3 MM HEIGHT, CERAMIC, BGA-255 | IBM | TSPC603EMGB/T3LL vs IBM25EMPPC603E2BB200K |
| TS(X)PC603EVGB/C4MN | RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSPC603EMGB/T3LL vs TS(X)PC603EVGB/C4MN |
| TS(X)PC603EVGB/T4ML | 32-BIT, 120MHz, RISC PROCESSOR, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603EMGB/T3LL vs TS(X)PC603EVGB/T4ML |
| TS(X)PC603EVGB/T5MN | RISC Microprocessor, 32-Bit, 133MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSPC603EMGB/T3LL vs TS(X)PC603EVGB/T5MN |
| TSXPC603RVGB/Q10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Teledyne e2v | TSPC603EMGB/T3LL vs TSXPC603RVGB/Q10LC |
| TSPC603PVGU/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSPC603EMGB/T3LL vs TSPC603PVGU/T8LE |
| TSPC603RMGSU/T12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 | Teledyne e2v | TSPC603EMGB/T3LL vs TSPC603RMGSU/T12LC |
| TS(X)PC603PMGB/T6LE | 32-BIT, 166MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 | Teledyne e2v | TSPC603EMGB/T3LL vs TS(X)PC603PMGB/T6LE |
| TSPC603RMGU10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Teledyne e2v | TSPC603EMGB/T3LL vs TSPC603RMGU10LC |