There are no models available for this part yet.
Overview of TS68EN360MRB/C25 by Thales Group
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
CAD Models for TS68EN360MRB/C25 by Thales Group
Part Data Attributes for TS68EN360MRB/C25 by Thales Group
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|---|---|
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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THOMSON-CSF SEMICONDUCTORS
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Part Package Code
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PGA
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Package Description
|
,
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Pin Count
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241
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Reach Compliance Code
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unknown
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ECCN Code
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3A001.A.2.C
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HTS Code
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8542.31.00.01
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JESD-30 Code
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S-CPGA-P241
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Number of Terminals
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241
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Qualification Status
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Not Qualified
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Screening Level
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MIL-STD-883
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Supply Voltage-Max
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5.25 V
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Supply Voltage-Min
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4.75 V
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Supply Voltage-Nom
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5 V
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Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
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MILITARY
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Terminal Form
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PIN/PEG
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Terminal Position
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PERPENDICULAR
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR, RISC
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Alternate Parts for TS68EN360MRB/C25
This table gives cross-reference parts and alternative options found for TS68EN360MRB/C25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TS68EN360MRB/C25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TS68EN360MRB/C33L | RISC Microprocessor, CMOS, CPGA241, CAVITY UP, CERAMIC, PGA-241 | Atmel Corporation | TS68EN360MRB/C25 vs TS68EN360MRB/C33L |
| TS68EN360MRB/C25L | RISC Microprocessor, CMOS, CPGA241, CAVITY UP, CERAMIC, PGA-241 | Teledyne e2v | TS68EN360MRB/C25 vs TS68EN360MRB/C25L |
| TS68EN360MRB/C33L | RISC Microprocessor, CMOS, CPGA241, CAVITY UP, CERAMIC, PGA-241 | Teledyne e2v | TS68EN360MRB/C25 vs TS68EN360MRB/C33L |
| TS68EN360DESC01MXA | RISC Microprocessor, CMOS, CPGA241, PGA-241 | Thales Group | TS68EN360MRB/C25 vs TS68EN360DESC01MXA |
| TS68EN360VR25L | RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA241, CERAMIC, PGA-241 | Atmel Corporation | TS68EN360MRB/C25 vs TS68EN360VR25L |
| TS68EN360MR25 | RISC Microprocessor, CMOS, CPGA241, PGA-241 | Thales Group | TS68EN360MRB/C25 vs TS68EN360MR25 |
| TS68EN360VR25 | RISC Microprocessor, CMOS, CPGA241, PGA-241 | Thales Group | TS68EN360MRB/C25 vs TS68EN360VR25 |
| TS68EN360MR1B/Q33L | RISC Microprocessor, 32-Bit, 33MHz, CMOS, CPGA241, CERAMIC, PGA-241 | Atmel Corporation | TS68EN360MRB/C25 vs TS68EN360MR1B/Q33L |
| TS68EN360MR1B/Q25L | RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA241, CERAMIC, PGA-241 | Teledyne e2v | TS68EN360MRB/C25 vs TS68EN360MR1B/Q25L |
| TS68EN360MR1B/C33L | RISC Microprocessor, CMOS, CPGA241, CAVITY UP, CERAMIC, PGA-241 | Atmel Corporation | TS68EN360MRB/C25 vs TS68EN360MR1B/C33L |