TS68EN360MRB/C25 vs TS68EN360VR25 feature comparison

TS68EN360MRB/C25 Thales Group

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TS68EN360VR25 Thales Group

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS THOMSON-CSF SEMICONDUCTORS
Part Package Code PGA PGA
Package Description , ,
Pin Count 241 241
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-CPGA-P241 S-CPGA-P241
Number of Terminals 241 241
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form PIN/PEG PIN/PEG
Terminal Position PERPENDICULAR PERPENDICULAR
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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Compare TS68EN360VR25 with alternatives