Part Details for TS(X)PC860MHMGU/T50C by Thales Group
Overview of TS(X)PC860MHMGU/T50C by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for TS(X)PC860MHMGU/T50C
TS(X)PC860MHMGU/T50C CAD Models
TS(X)PC860MHMGU/T50C Part Data Attributes
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TS(X)PC860MHMGU/T50C
Thales Group
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Datasheet
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TS(X)PC860MHMGU/T50C
Thales Group
Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | , | |
Pin Count | 357 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 50 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B357 | |
Low Power Mode | NO | |
Number of Terminals | 357 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for TS(X)PC860MHMGU/T50C
This table gives cross-reference parts and alternative options found for TS(X)PC860MHMGU/T50C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TS(X)PC860MHMGU/T50C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TS(X)PC860MHMZPU/T50C | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHMGU/T50C vs TS(X)PC860MHMZPU/T50C |
MPC860SRZQ80D4 | PowerQUICC, 32 Bit Power Architecture, 80MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | TS(X)PC860MHMGU/T50C vs MPC860SRZQ80D4 |
TS(X)PC860MHMGB/T40(A) | RISC Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CBGA, 357 PIN | Thales Group | TS(X)PC860MHMGU/T50C vs TS(X)PC860MHMGB/T40(A) |
TSPC860MHVZPU/T50C | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHMGU/T50C vs TSPC860MHVZPU/T50C |
TS(X)PC860MHMZPB/C40(A) | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PBGA, 357 PIN | Thales Group | TS(X)PC860MHMGU/T50C vs TS(X)PC860MHMZPB/C40(A) |
TSPC860MHMZPU/T40C | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHMGU/T50C vs TSPC860MHMZPU/T40C |
XPC860DEZP80D4 | 32-BIT, 80 MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHMGU/T50C vs XPC860DEZP80D4 |
TSPC860MHVGU50C | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHMGU/T50C vs TSPC860MHVGU50C |
TS(X)PC860MHMGU40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHMGU/T50C vs TS(X)PC860MHMGU40A3 |
TSPC860MHVZP40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHMGU/T50C vs TSPC860MHVZP40A3 |