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SPC5516EAVMG80 by:

Freescale 32-bit MCU, Power Arch, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, MAPBGA 208

Part Details for SPC5516EAVMG80 by Freescale Semiconductor

Overview of SPC5516EAVMG80 by Freescale Semiconductor

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for SPC5516EAVMG80

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SPC5516EAVMG80 Part Data Attributes

SPC5516EAVMG80 Freescale Semiconductor
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SPC5516EAVMG80 Freescale Semiconductor Freescale 32-bit MCU, Power Arch, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, MAPBGA 208
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 17 X 17 MM, 0.80 HEIGHT, 1 MM PITCH, MAPBGA-208
Pin Count 208
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width 32
Bit Size 32
CPU Family E200
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width 32
JESD-30 Code S-PBGA-B208
JESD-609 Code e2
Moisture Sensitivity Level 3
Number of I/O Lines 130
Number of Terminals 208
On Chip Program ROM Width 8
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA208,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 262144
ROM Programmability FLASH
Screening Level AEC-Q100
Speed 66 MHz
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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