There are no models available for this part yet.
Overview of S71PL064JA0BFW070 by Spansion
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for S71PL064JA0BFW070 by Spansion
Part Data Attributes for S71PL064JA0BFW070 by Spansion
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SPANSION INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
|
|
Pin Count
|
56
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Access Time-Max
|
65 ns
|
|
Additional Feature
|
PSRAM IS ORGANIZED AS 1M X 16
|
|
JESD-30 Code
|
R-PBGA-B56
|
|
JESD-609 Code
|
e1
|
|
Length
|
9 mm
|
|
Memory Density
|
67108864 bit
|
|
Memory IC Type
|
MEMORY CIRCUIT
|
|
Memory Width
|
16
|
|
Mixed Memory Type
|
FLASH+PSRAM
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
56
|
|
Number of Words
|
4194304 words
|
|
Number of Words Code
|
4000000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-25 °C
|
|
Organization
|
4MX16
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TFBGA
|
|
Package Equivalence Code
|
BGA56,8X8,32
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.2 mm
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL EXTENDED
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
7 mm
|
Alternate Parts for S71PL064JA0BFW070
This table gives cross-reference parts and alternative options found for S71PL064JA0BFW070. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S71PL064JA0BFW070, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S71PL064JA0BAW074 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BAW074 |
| S71PL064JA0BAI072 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BAI072 |
| S71PL064JA0BAW071 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BAW071 |
| S71PL064JA0BFW074 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BFW074 |
| S71PL064JA0BAI073 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BAI073 |
| S71PL064JA0BFI073 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BFI073 |
| S71PL064JA0BFW071 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, LEAD FREE, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BFW071 |
| S71PL064JA0BFW072 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BFW072 |
| S71PL064JA0BFI072 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BFI072 |
| S71PL064JA0BAW072 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064JA0BFW070 vs S71PL064JA0BAW072 |