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Overview of S71GL032N80BFW0P2 by Spansion
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for S71GL032N80BFW0P2 by Spansion
Part Data Attributes for S71GL032N80BFW0P2 by Spansion
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
SPANSION INC
|
Part Package Code
|
BGA
|
Package Description
|
7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
|
Pin Count
|
56
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
Additional Feature
|
PSRAM IS ORGANIZED AS 512K X 16
|
JESD-30 Code
|
R-PBGA-B56
|
JESD-609 Code
|
e1
|
Length
|
9 mm
|
Memory Density
|
33554432 bit
|
Memory IC Type
|
MEMORY CIRCUIT
|
Memory Width
|
16
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
56
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-25 °C
|
Organization
|
2MX16
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TFBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.2 mm
|
Supply Voltage-Max (Vsup)
|
3.1 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
Width
|
7 mm
|
Alternate Parts for S71GL032N80BFW0P2
This table gives cross-reference parts and alternative options found for S71GL032N80BFW0P2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S71GL032N80BFW0P2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
S71GL032N80BHW0P3 | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | Spansion | S71GL032N80BFW0P2 vs S71GL032N80BHW0P3 |
S71GL032N80BFW0P0 | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71GL032N80BFW0P2 vs S71GL032N80BFW0P0 |
S71GL032N80BFW0P3 | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71GL032N80BFW0P2 vs S71GL032N80BFW0P3 |
S71GL032N80BHW0P2 | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | Spansion | S71GL032N80BFW0P2 vs S71GL032N80BHW0P2 |
S71GL032N80BHW0P2 | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | Cypress Semiconductor | S71GL032N80BFW0P2 vs S71GL032N80BHW0P2 |
S71GL032N80BFW0P2 | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Cypress Semiconductor | S71GL032N80BFW0P2 vs S71GL032N80BFW0P2 |