Part Details for S71GL032N80BHW0P2 by Spansion
Overview of S71GL032N80BHW0P2 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for S71GL032N80BHW0P2
S71GL032N80BHW0P2 CAD Models
S71GL032N80BHW0P2 Part Data Attributes
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S71GL032N80BHW0P2
Spansion
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Datasheet
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S71GL032N80BHW0P2
Spansion
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | BGA | |
Package Description | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | |
Pin Count | 56 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | PSRAM IS ORGANIZED AS 512K X 16 | |
JESD-30 Code | R-PBGA-B56 | |
JESD-609 Code | e1 | |
Length | 9 mm | |
Memory Density | 33554432 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 56 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Organization | 2MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.1 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 7 mm |
Alternate Parts for S71GL032N80BHW0P2
This table gives cross-reference parts and alternative options found for S71GL032N80BHW0P2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S71GL032N80BHW0P2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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S71GL032N80BHW0P0 | Spansion | Check for Price | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | S71GL032N80BHW0P2 vs S71GL032N80BHW0P0 |
S71GL032N80BFW0P2 | Cypress Semiconductor | Check for Price | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | S71GL032N80BHW0P2 vs S71GL032N80BFW0P2 |
S71GL032N80BHW0P2 | Cypress Semiconductor | Check for Price | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | S71GL032N80BHW0P2 vs S71GL032N80BHW0P2 |
S71GL032N80BFW0P2 | Spansion | Check for Price | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | S71GL032N80BHW0P2 vs S71GL032N80BFW0P2 |
S71GL032N80BFW0P0 | Spansion | Check for Price | Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | S71GL032N80BHW0P2 vs S71GL032N80BFW0P0 |