Datasheets
S632000M-P by: Gould Ami

MASK ROM, 256KX8, 250ns, CMOS, PDIP40

Part Details for S632000M-P by Gould Ami

Overview of S632000M-P by Gould Ami

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Applications Space Technology Aerospace and Defense

Part Details for S632000M-P

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S632000M-P Part Data Attributes

S632000M-P Gould Ami
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S632000M-P Gould Ami MASK ROM, 256KX8, 250ns, CMOS, PDIP40
Part Life Cycle Code Obsolete
Ihs Manufacturer GOULD AMI
Package Description ,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 60 ns
JESD-30 Code R-PDIP-T40
Memory Density 65536 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 40
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for S632000M-P

This table gives cross-reference parts and alternative options found for S632000M-P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S632000M-P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M27C202-100F6 128KX16 UVPROM, 100ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics S632000M-P vs M27C202-100F6
M27C202-70F6 128KX16 UVPROM, 70ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics S632000M-P vs M27C202-70F6
AM27C2048-70DI UVPROM, 128KX16, 70ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion S632000M-P vs AM27C2048-70DI
AM27C2048-155PC OTP ROM, 128KX16, 150ns, CMOS, PDIP40, PLASTIC, DIP-40 AMD S632000M-P vs AM27C2048-155PC
AM27C2048-90DIB UVPROM, 128KX16, 90ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion S632000M-P vs AM27C2048-90DIB
AM27C2048-70PC OTP ROM, 128KX16, 70ns, CMOS, PDIP40, PLASTIC, DIP-40 Spansion S632000M-P vs AM27C2048-70PC
AM27C2048-255DC UVPROM, 128KX16, 250ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion S632000M-P vs AM27C2048-255DC
AM27X2048-70PI MASK ROM, 128KX16, 70ns, CMOS, PDIP40, PLASTIC, DIP-40 AMD S632000M-P vs AM27X2048-70PI
M27C202-90F3 128KX16 UVPROM, 90ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics S632000M-P vs M27C202-90F3
AM27C2048-55DC UVPROM, 128KX16, 55ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion S632000M-P vs AM27C2048-55DC

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