Datasheets
S29GL01GS11DHIV23 by:

Flash, 128MX8, 110ns, PBGA64,

Part Details for S29GL01GS11DHIV23 by Infineon Technologies AG

Overview of S29GL01GS11DHIV23 by Infineon Technologies AG

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Price & Stock for S29GL01GS11DHIV23

Part # Distributor Description Stock Price Buy
DISTI # 448-S29GL01GS11DHIV23TR-ND
DigiKey IC FLASH 1GBIT PARALLEL 64FBGA Min Qty: 2200 Lead time: 8 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 2,200 $9.4555
$9.4555 Buy Now
DISTI # S29GL01GS11DHIV23
Avnet Americas NOR Flash Parallel 3V 1G-bit 64M x 16bit 110ns 64-Pin FBGA T/R - Tape and Reel (Alt: S29GL01GS11DHIV23) RoHS: Compliant Min Qty: 2200 Package Multiple: 2200 Lead time: 8 Weeks, 0 Days Container: Reel 0
  • 2,200 $11.0670
$11.0670 Buy Now
DISTI # 727-29GL01GS11DHIV23
Mouser Electronics NOR Flash Nor RoHS: Compliant 0
  • 2,200 $9.1700
$9.1700 Order Now
Future Electronics   RoHS: Compliant pbFree: No Min Qty: 2200 Package Multiple: 2200 Lead time: 8 Weeks Container: Reel 0
Reel
  • 2,200 $8.9300
$8.9300 Buy Now

Part Details for S29GL01GS11DHIV23

S29GL01GS11DHIV23 CAD Models

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S29GL01GS11DHIV23 Part Data Attributes:

S29GL01GS11DHIV23 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
S29GL01GS11DHIV23 Infineon Technologies AG Flash, 128MX8, 110ns, PBGA64,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Reach Compliance Code compliant
Factory Lead Time 8 Weeks
Samacsys Manufacturer Infineon
Access Time-Max 110 ns
Additional Feature 20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES
Alternate Memory Width 1
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Data Retention Time-Min 2
Endurance 100000 Write/Erase Cycles
JESD-30 Code S-PBGA-B64
JESD-609 Code e1
Length 9 mm
Memory Density 1073741824 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 1K
Number of Terminals 64
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA64,8X8,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Page Size 32 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Ready/Busy YES
Seated Height-Max 1.4 mm
Sector Size 128K
Standby Current-Max 0.0001 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit YES
Type NAND TYPE
Width 9 mm

Alternate Parts for S29GL01GS11DHIV23

This table gives cross-reference parts and alternative options found for S29GL01GS11DHIV23. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL01GS11DHIV23, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
S29GL01GS11DHI013 Flash, 128MX8, 110ns, PBGA64, FBGA-64 Cypress Semiconductor S29GL01GS11DHIV23 vs S29GL01GS11DHI013
S29GL01GS11FHI010 Flash, 128MX8, 110ns, PBGA64, Cypress Semiconductor S29GL01GS11DHIV23 vs S29GL01GS11FHI010
S29GL01GS11DHI020 Flash, 128MX8, 110ns, PBGA64, FBGA-64 Cypress Semiconductor S29GL01GS11DHIV23 vs S29GL01GS11DHI020
S29GL01GS11DHIV23 Flash, 128MX8, 110ns, PBGA64, 9 X 9 MM, LEAD FREE, FBGA-64 Spansion S29GL01GS11DHIV23 vs S29GL01GS11DHIV23
S29GL01GS11FHIV10 Flash, 128MX8, 110ns, PBGA64, Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS11FHIV10
S29GL01GS11DHIV10 Flash, 128MX8, 110ns, PBGA64, LEAD FREE, PACKAGE Spansion S29GL01GS11DHIV23 vs S29GL01GS11DHIV10
S29GL01GS11FHI023 EEPROM Card, 64MX16, 110ns, Parallel, CMOS, PBGA64, FBGA-64 Cypress Semiconductor S29GL01GS11DHIV23 vs S29GL01GS11FHI023
S29GL01GS11DHIV10 Flash, 128MX8, 110ns, PBGA64, Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS11DHIV10
S29GL01GS11DHIV20 Flash, 128MX8, 110ns, PBGA64, Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS11DHIV20
S29GL01GS11DHI010 Flash, 128MX8, 110ns, PBGA64, FBGA-64 Cypress Semiconductor S29GL01GS11DHIV23 vs S29GL01GS11DHI010
Part Number Description Manufacturer Compare
S29GL01GS11FHIV20 Flash, 64MX16, 110ns, PBGA64, FBGA-64 Cypress Semiconductor S29GL01GS11DHIV23 vs S29GL01GS11FHIV20
S29GL01GS11DHIV10 Flash, 128MX8, 110ns, PBGA64, Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS11DHIV10
S29GL01GS12DHIV20 Flash, 128MX8, 120ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS12DHIV20
S29GL01GS11DHI010 Flash, 128MX8, 110ns, PBGA64, FBGA-64 Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS11DHI010
S29GL01GS12DHIV10 Flash, 128MX8, 120ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS12DHIV10
S29GL01GS11DHI023 Flash, 128MX8, 110ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 Spansion S29GL01GS11DHIV23 vs S29GL01GS11DHI023
S29GL01GS11FHI010 Flash, 128MX8, 110ns, PBGA64, Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS11FHI010
S29GL01GS10DHI020 Flash, 128MX8, 100ns, PBGA64, LEAD FREE, PACKAGE Spansion S29GL01GS11DHIV23 vs S29GL01GS10DHI020
S29GL01GS10DHI020 Flash, 128MX8, 100ns, PBGA64, PACKAGE Cypress Semiconductor S29GL01GS11DHIV23 vs S29GL01GS10DHI020
S29GL01GS10FHI020 Flash, 128MX8, 100ns, PBGA64, Infineon Technologies AG S29GL01GS11DHIV23 vs S29GL01GS10FHI020

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