Datasheets
QP7C291A-35DMB by:

OTP ROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24

Part Details for QP7C291A-35DMB by QP Semiconductor

Overview of QP7C291A-35DMB by QP Semiconductor

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Part Details for QP7C291A-35DMB

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QP7C291A-35DMB Part Data Attributes

QP7C291A-35DMB QP Semiconductor
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QP7C291A-35DMB QP Semiconductor OTP ROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24
Part Life Cycle Code Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP,
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
JESD-30 Code R-GDIP-T24
Memory Density 16384 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for QP7C291A-35DMB

This table gives cross-reference parts and alternative options found for QP7C291A-35DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QP7C291A-35DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8873403JA OTP ROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor QP7C291A-35DMB vs 5962-8873403JA
5962-8765001LX UVPROM, 2KX8, 50ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor QP7C291A-35DMB vs 5962-8765001LX
5962-8765003JA UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor QP7C291A-35DMB vs 5962-8765003JA
5962-8765005LA UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor QP7C291A-35DMB vs 5962-8765005LA
5962-8765003LA UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor QP7C291A-35DMB vs 5962-8765003LA
M2716F6 UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Thales Group QP7C291A-35DMB vs M2716F6
5962-8765005JA UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor QP7C291A-35DMB vs 5962-8765005JA
M38510/21002BJA OTP ROM, 2KX8, 100ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 QP Semiconductor QP7C291A-35DMB vs M38510/21002BJA
M38510/21004BJX OTP ROM, 2KX8, 55ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 QP Semiconductor QP7C291A-35DMB vs M38510/21004BJX
NMC27C16BQE150 2KX8 UVPROM, 150ns, CDIP24, CERAMIC, DIP-24 Texas Instruments QP7C291A-35DMB vs NMC27C16BQE150

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