Memory
M38510/21004BJX
Description: OTP ROM, 2KX8, 55ns, Bipolar, 0.5 X 0.75 INCH, DIP-24

Overview of M38510/21004BJX by QP Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Aerospace and Defense Transportation and Logistics Automotive

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Part Data Attributes for M38510/21004BJX by QP Semiconductor

M38510/21004BJX
QP Semiconductor
-
-
Part Life Cycle Code
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
24
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
55 ns
JESD-30 Code
R-XDIP-T24
Memory Density
16384 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
2048 words
Number of Words Code
2000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
2KX8
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
BIPOLAR
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Want to compare parts?
  1. M38510/21004BJX
    QP Semiconductor
    OTP ROM, 2KX8, 55ns, Bipolar, 0.5 X 0.75 INCH, DIP-24
    VS

Alternate Parts for M38510/21004BJX

This table gives cross-reference parts and alternative options found for M38510/21004BJX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/21004BJX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
M38510/21004BLA OTP ROM, 2KX8, 55ns, Bipolar, 0.25 X 0.75 INCH, DIP-24 QP Semiconductor M38510/21004BJX vs M38510/21004BLA
MB7138-EWZSK 2KX8 OTPROM, 55ns, CDIP24, 0.300 INCH, CERDIP-24 FUJITSU Limited M38510/21004BJX vs MB7138-EWZSK
M38510/21004BLX OTP ROM, 2KX8, 55ns, Bipolar, 0.25 X 0.75 INCH, DIP-24 QP Semiconductor M38510/21004BJX vs M38510/21004BLX
M38510/21004BJA OTP ROM, 2KX8, 55ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 QP Semiconductor M38510/21004BJX vs M38510/21004BJA
Part Number Description Manufacturer Compare
5962-8873403JA OTP ROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M38510/21004BJX vs 5962-8873403JA
5962-8765001LX UVPROM, 2KX8, 50ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor M38510/21004BJX vs 5962-8765001LX
5962-8765003JA UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M38510/21004BJX vs 5962-8765003JA
5962-8765005LA UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor M38510/21004BJX vs 5962-8765005LA
5962-8765003LA UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor M38510/21004BJX vs 5962-8765003LA
M2716F6 UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Thales Group M38510/21004BJX vs M2716F6
5962-8765005JA UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M38510/21004BJX vs 5962-8765005JA
M38510/21002BJA OTP ROM, 2KX8, 100ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 QP Semiconductor M38510/21004BJX vs M38510/21002BJA
NMC27C16BQE150 2KX8 UVPROM, 150ns, CDIP24, CERAMIC, DIP-24 Texas Instruments M38510/21004BJX vs NMC27C16BQE150
5962-8765001JA UVPROM, 2KX8, 50ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M38510/21004BJX vs 5962-8765001JA

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