Part Details for QD27C512-200V10 by Intel Corporation
Overview of QD27C512-200V10 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for QD27C512-200V10
QD27C512-200V10 CAD Models
QD27C512-200V10 Part Data Attributes
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QD27C512-200V10
Intel Corporation
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Datasheet
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QD27C512-200V10
Intel Corporation
UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
JESD-30 Code | R-GDIP-T28 | |
Length | 37.15 mm | |
Memory Density | 524288 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.72 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for QD27C512-200V10
This table gives cross-reference parts and alternative options found for QD27C512-200V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD27C512-200V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C512-200DC | UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | QD27C512-200V10 vs AM27C512-200DC |
M27C512-20F3 | 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | QD27C512-200V10 vs M27C512-20F3 |
AM27C512L-200DE | UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD27C512-200V10 vs AM27C512L-200DE |
NMC27C512AQ200 | 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | QD27C512-200V10 vs NMC27C512AQ200 |
M27C512-20F1 | 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | QD27C512-200V10 vs M27C512-20F1 |
NMC27C512AQ200 | IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | QD27C512-200V10 vs NMC27C512AQ200 |
LD27C513-200V10 | UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 | Intel Corporation | QD27C512-200V10 vs LD27C513-200V10 |
MSM27512-20AS | UVPROM, 64KX8, 200ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OKI Electric Industry Co Ltd | QD27C512-200V10 vs MSM27512-20AS |
27LV512-20/J | 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | QD27C512-200V10 vs 27LV512-20/J |
TD27C513-200V10 | UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 | Intel Corporation | QD27C512-200V10 vs TD27C513-200V10 |