Part Details for QD27128-3 by Intel Corporation
Overview of QD27128-3 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for QD27128-3
QD27128-3 CAD Models
QD27128-3 Part Data Attributes
|
|
QD27128-3
Intel Corporation
Buy Now
Datasheet
|
Compare Parts:
QD27128-3
Intel Corporation
UVPROM, 16KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.084 mm | |
| Memory Density | 131072 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 21 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for QD27128-3
This table gives cross-reference parts and alternative options found for QD27128-3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD27128-3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DC27128-30 | UVPROM, 16KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | LSI Corporation | QD27128-3 vs DC27128-30 |
| 5962-8766107XX | 16K X 8 UVPROM, 300 ns, CDIP28, CERAMIC, DIP-28 | Microchip Technology Inc | QD27128-3 vs 5962-8766107XX |
| 5962-8766107XX | 16KX8 UVPROM, 300ns, CDIP28 | Texas Instruments | QD27128-3 vs 5962-8766107XX |
| AM27C128-300DI | UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD27128-3 vs AM27C128-300DI |
| 8202504YX | UVPROM, 16KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | LSI Corporation | QD27128-3 vs 8202504YX |
| AM27C128-300/BXA | UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD27128-3 vs AM27C128-300/BXA |
| 5962-8766107XA | 16KX8 UVPROM, 300ns, CDIP28 | Texas Instruments | QD27128-3 vs 5962-8766107XA |
| AM27128A-30/BXA | UVPROM, 16KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | QD27128-3 vs AM27128A-30/BXA |
| AM27C128-300DEB | UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD27128-3 vs AM27C128-300DEB |
| 8202509YA | UVPROM, 16KX8, 300ns, CMOS, CDIP28, DIP-28 | LSI Corporation | QD27128-3 vs 8202509YA |