Memory
AM27C128-300/BXA
AMD
Description: UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

Overview of AM27C128-300/BXA by AMD

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Internet of Things (IoT) Computing and Data Storage

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Part Data Attributes for AM27C128-300/BXA by AMD

AM27C128-300/BXA
AMD
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
Package Description
WDIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
300 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
JESD-609 Code
e0
Length
37.1475 mm
Memory Density
131072 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
16384 words
Number of Words Code
16000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.588 mm
Standby Current-Max
0.00012 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. AM27C128-300/BXA
    AMD
    UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
    VS

Alternate Parts for AM27C128-300/BXA

This table gives cross-reference parts and alternative options found for AM27C128-300/BXA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C128-300/BXA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AM27C128-300DEB UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-300DEB
AM27C128-305DC UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-305DC
AM27128A-30DCB UVPROM, 16KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27128A-30DCB
AM27C128-300DE UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-300DE
AM27C128-300DC UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-300DC
AM27128A-30/BXA UVPROM, 16KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27128A-30/BXA
DC27128-30 UVPROM, 16KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 LSI Corporation AM27C128-300/BXA vs DC27128-30
5962-8766107XX 16K X 8 UVPROM, 300 ns, CDIP28, CERAMIC, DIP-28 Microchip Technology Inc AM27C128-300/BXA vs 5962-8766107XX
8202504YX UVPROM, 16KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 LSI Corporation AM27C128-300/BXA vs 8202504YX
AM27C128-305DI UVPROM, 16KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-305DI
Part Number Description Manufacturer Compare
AM27C128-200LEB UVPROM, 16KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C128-300/BXA vs AM27C128-200LEB
AM27C128-75DCB UVPROM, 16KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-75DCB
AM27C128-200DEB UVPROM, 16KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-200DEB
AM27C128-70DIB UVPROM, 16KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C128-300/BXA vs AM27C128-70DIB
NMC27C128BQ150 IC 16K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27C128-300/BXA vs NMC27C128BQ150
AM27C128-150/BUA UVPROM, 16KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C128-300/BXA vs AM27C128-150/BUA
WS57C128F-70D UVPROM, 16KX8, 70ns, CMOS, CDIP28, Waferscale Integration Inc AM27C128-300/BXA vs WS57C128F-70D
NMC27C128BQ150 IC 16K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM Texas Instruments AM27C128-300/BXA vs NMC27C128BQ150
27C128-20I/J 16K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc AM27C128-300/BXA vs 27C128-20I/J
TMS27C128-25JE 131 072-Bit UV Erasable Programmable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments AM27C128-300/BXA vs TMS27C128-25JE

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