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Microcontrollers and Processors / Microprocessors / PCX755VGS400LE
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PCX755VGS400LE by: e2v technologies

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Part Details for PCX755VGS400LE by e2v technologies

Overview of PCX755VGS400LE by e2v technologies

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Part Details for PCX755VGS400LE

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PCX755VGS400LE Part Data Attributes

Parametric Data
PCX755VGS400LE e2v technologies
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PCX755VGS400LE e2v technologies RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code CGA
Package Description CGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-X360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code CGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Speed 400 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form UNSPECIFIED
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PCX755VGS400LE

This table gives cross-reference parts and alternative options found for PCX755VGS400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755VGS400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PCX755VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies PCX755VGS400LE vs PCX755VGSU400LE
PC755VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PCX755VGS400LE vs PC755VGSU400LE
PC755MGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PCX755VGS400LE vs PC755MGS400LE
PC755BMGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PCX755VGS400LE vs PC755BMGSU400LE
PC755CMGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 e2v technologies PCX755VGS400LE vs PC755CMGS400LE
PC755MGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PCX755VGS400LE vs PC755MGSU400LE
PC755VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies PCX755VGS400LE vs PC755VGSU400LE
PCX755MGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies PCX755VGS400LE vs PCX755MGS400LE
PCX755MGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies PCX755VGS400LE vs PCX755MGSU400LE
PC755CVGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 e2v technologies PCX755VGS400LE vs PC755CVGS400LE
Part Number Description Manufacturer Compare
MPC755BPX400LX 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 Motorola Mobility LLC PCX755VGS400LE vs MPC755BPX400LX
PC755VGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies PCX755VGS400LE vs PC755VGS400LE
IBM25EMPPC750LCBA4000 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PCX755VGS400LE vs IBM25EMPPC750LCBA4000
PCX755CMGH400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 e2v technologies PCX755VGS400LE vs PCX755CMGH400LE
XPC755BPX400LER2 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 Freescale Semiconductor PCX755VGS400LE vs XPC755BPX400LER2
PCX755MG400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies PCX755VGS400LE vs PCX755MG400LE
MPC755BRX400LX 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PCX755VGS400LE vs MPC755BRX400LX
XPC755CRX400 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor PCX755VGS400LE vs XPC755CRX400
MPC755CVT400 32-BIT, 400MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PCX755VGS400LE vs MPC755CVT400
PC755CMGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 e2v technologies PCX755VGS400LE vs PC755CMGS400LE

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