Part Details for PCX755BMGHU350LE by Teledyne e2v
Overview of PCX755BMGHU350LE by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for PCX755BMGHU350LE
PCX755BMGHU350LE CAD Models
PCX755BMGHU350LE Part Data Attributes
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PCX755BMGHU350LE
Teledyne e2v
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Datasheet
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PCX755BMGHU350LE
Teledyne e2v
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.24 mm | |
| Speed | 350 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PCX755BMGHU350LE
This table gives cross-reference parts and alternative options found for PCX755BMGHU350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755BMGHU350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PC755BMG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | PCX755BMGHU350LE vs PC755BMG350LE |
| PC755BMGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | PCX755BMGHU350LE vs PC755BMGU350LE |
| PCX755BVGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PCX755BMGHU350LE vs PCX755BVGU350LE |
| PC755BMGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PCX755BMGHU350LE vs PC755BMGU350LE |
| PCX755BVG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PCX755BMGHU350LE vs PCX755BVG350LE |
| PCX755BVZF350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Teledyne e2v | PCX755BMGHU350LE vs PCX755BVZF350LE |
| PC755BMG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PCX755BMGHU350LE vs PC755BMG350LE |
| PC755BMGHU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | PCX755BMGHU350LE vs PC755BMGHU350LE |
| PC755BVGH350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | PCX755BMGHU350LE vs PC755BVGH350LE |
| XPC755BPX350LB | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Motorola Semiconductor Products | PCX755BMGHU350LE vs XPC755BPX350LB |