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Microcontrollers and Processors / Microprocessors / PC755CVGHU300LE
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PC755CVGHU300LE by:

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360

Part Details for PC755CVGHU300LE by Teledyne e2v

Overview of PC755CVGHU300LE by Teledyne e2v

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755CVGHU300LE

PC755CVGHU300LE CAD Models

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PC755CVGHU300LE Part Data Attributes

Parametric Data
PC755CVGHU300LE Teledyne e2v
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PC755CVGHU300LE Teledyne e2v RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 110 °C
Operating Temperature-Min 40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.24 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755CVGHU300LE

This table gives cross-reference parts and alternative options found for PC755CVGHU300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755CVGHU300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PCX755BMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group PC755CVGHU300LE vs PCX755BMZFU300LE
XPC755BRX300LD 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 Motorola Mobility LLC PC755CVGHU300LE vs XPC755BRX300LD
PC755VGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755CVGHU300LE vs PC755VGU300LE
PC755CMGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC755CVGHU300LE vs PC755CMGSU300LE
PC755BVZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Atmel Corporation PC755CVGHU300LE vs PC755BVZFU300LD
PC755CVZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP-CHIP, PLASTIC, BGA-360 Atmel Corporation PC755CVGHU300LE vs PC755CVZFU300LE
PC755MZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755CVGHU300LE vs PC755MZF300LE
PCX755VZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755CVGHU300LE vs PCX755VZFU300LE
PCX755VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755CVGHU300LE vs PCX755VZF300LE
PC755CVGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC755CVGHU300LE vs PC755CVGSU300LE
Part Number Description Manufacturer Compare
MPC755BRX300LX 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC755CVGHU300LE vs MPC755BRX300LX
PCX755BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Atmel Corporation PC755CVGHU300LE vs PCX755BMZFU300LD
PC755MGH300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC755CVGHU300LE vs PC755MGH300LE
PCX755BMZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755CVGHU300LE vs PCX755BMZF300LE
PC755CMGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755CVGHU300LE vs PC755CMGSU300LE
MPC755BPX300 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755CVGHU300LE vs MPC755BPX300
IBM25PPC750L-EB0B300W RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755CVGHU300LE vs IBM25PPC750L-EB0B300W
MPC755BPX300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755CVGHU300LE vs MPC755BPX300LE
PC755CVZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP-CHIP, PLASTIC, BGA-360 Teledyne e2v PC755CVGHU300LE vs PC755CVZFU300LE
PC755BMGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755CVGHU300LE vs PC755BMGSU300LE

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