Part Details for PC7410MGH400LE by Teledyne e2v
Overview of PC7410MGH400LE by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PC7410MGH400LE
PC7410MGH400LE CAD Models
PC7410MGH400LE Part Data Attributes
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PC7410MGH400LE
Teledyne e2v
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Datasheet
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PC7410MGH400LE
Teledyne e2v
RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | E2V TECHNOLOGIES PLC | |
Part Package Code | BGA | |
Package Description | BGA, BGA360,19X19,50 | |
Pin Count | 360 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 133 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 400 MHz | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC7410MGH400LE
This table gives cross-reference parts and alternative options found for PC7410MGH400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC7410MGH400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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PCX7410MGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PC7410MGH400LE vs PCX7410MGU400LE |
MPC7410RX400LD | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC | Freescale Semiconductor | PC7410MGH400LE vs MPC7410RX400LD |
MPC7410RX400LD | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | PC7410MGH400LE vs MPC7410RX400LD |
PC7410VGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Teledyne e2v | PC7410MGH400LE vs PC7410VGU400LE |
MPC7410THX400LE | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | PC7410MGH400LE vs MPC7410THX400LE |
MPC7410VS400LE | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, LGA-360 | Freescale Semiconductor | PC7410MGH400LE vs MPC7410VS400LE |
PC7410MG400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Teledyne e2v | PC7410MGH400LE vs PC7410MG400LE |
PCX7410VGHU400NE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 | Teledyne e2v | PC7410MGH400LE vs PCX7410VGHU400NE |
PC7410VGHU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | PC7410MGH400LE vs PC7410VGHU400LE |
PC7410VGS400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 | Teledyne e2v | PC7410MGH400LE vs PC7410VGS400LE |