Microcontrollers and Processors
MPC7410RX400LD
Description: 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

Overview of MPC7410RX400LD by Motorola Mobility LLC

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Part Data Attributes for MPC7410RX400LD by Motorola Mobility LLC

MPC7410RX400LD
Motorola Mobility LLC
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MOTOROLA INC
Part Package Code
BGA
Package Description
BGA,
Pin Count
360
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
133 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B360
Length
25 mm
Low Power Mode
YES
Number of Terminals
360
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
3.2 mm
Speed
400 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Want to compare parts?
  1. MPC7410RX400LD
    Motorola Mobility LLC
    32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
    VS

Alternate Parts for MPC7410RX400LD

This table gives cross-reference parts and alternative options found for MPC7410RX400LD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410RX400LD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MPC7410THX400LE 32-BIT, 400MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors MPC7410RX400LD vs MPC7410THX400LE
MPC7410RX400LC 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor MPC7410RX400LD vs MPC7410RX400LC
MPC7410HX400LE 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor MPC7410RX400LD vs MPC7410HX400LE
PCX7410VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation MPC7410RX400LD vs PCX7410VGSU400LE
PCX7410MGU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PCX7410MGU400LE
PC7410VGHU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PC7410VGHU400LE
PCX7410VGU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 Atmel Corporation MPC7410RX400LD vs PCX7410VGU400LE
PC7410MGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation MPC7410RX400LD vs PC7410MGS400LE
MPC7410RX400NE 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor MPC7410RX400LD vs MPC7410RX400NE
MPC7410VS400LE 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, LGA-360 Freescale Semiconductor MPC7410RX400LD vs MPC7410VS400LE
Part Number Description Manufacturer Compare
PCX7410MGU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PCX7410MGU400LE
MPC7410RX400LD IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC Freescale Semiconductor MPC7410RX400LD vs MPC7410RX400LD
PC7410MGH400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PC7410MGH400LE
PC7410VGU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PC7410VGU400LE
MPC7410THX400LE 32-BIT, 400MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors MPC7410RX400LD vs MPC7410THX400LE
MPC7410VS400LE 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, LGA-360 Freescale Semiconductor MPC7410RX400LD vs MPC7410VS400LE
PC7410MG400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PC7410MG400LE
PCX7410VGHU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PCX7410VGHU400NE
PC7410VGHU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PC7410VGHU400LE
PC7410VGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v MPC7410RX400LD vs PC7410VGS400LE

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