Datasheets
P5C164X200L32MB by: Pyramid Semiconductor Corporation

EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32

Part Details for P5C164X200L32MB by Pyramid Semiconductor Corporation

Overview of P5C164X200L32MB by Pyramid Semiconductor Corporation

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for P5C164X200L32MB

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P5C164X200L32MB Part Data Attributes

P5C164X200L32MB Pyramid Semiconductor Corporation
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P5C164X200L32MB Pyramid Semiconductor Corporation EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP
Part Package Code QFJ
Package Description 0.450 X 0.550 INCH, CERAMIC, LCC-32
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 200 ns
JESD-30 Code R-CQCC-N32
JESD-609 Code e0
Length 13.97 mm
Memory Density 65536 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 1.905 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.43 mm

Alternate Parts for P5C164X200L32MB

This table gives cross-reference parts and alternative options found for P5C164X200L32MB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P5C164X200L32MB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
28C64A-20I/K 8K X 8 EEPROM 5V, 200 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc P5C164X200L32MB vs 28C64A-20I/K
PYA28C64-20LMB EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 Pyramid Semiconductor Corporation P5C164X200L32MB vs PYA28C64-20LMB
AT28PC64-20LC EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation P5C164X200L32MB vs AT28PC64-20LC
LQ28C64-200 EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32 LSI Corporation P5C164X200L32MB vs LQ28C64-200
LQ28C65-200 EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32 LSI Corporation P5C164X200L32MB vs LQ28C65-200
LE2864-200 EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32 LSI Corporation P5C164X200L32MB vs LE2864-200
X28C64EMB-20T1 EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc P5C164X200L32MB vs X28C64EMB-20T1
AM2864BE-200LIB EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864BE-200LIB
AM2864AE-200LC EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864AE-200LC
AM2864A-2LIB EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864A-2LIB
Part Number Description Manufacturer Compare
AM2864B-2LE EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864B-2LE
AM2864A-20LC EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864A-20LC
AM2864BE-200LE EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864BE-200LE
AT28C64X-20LI EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation P5C164X200L32MB vs AT28C64X-20LI
AM2864A-2LC EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864A-2LC
X28C64GI-20 EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc P5C164X200L32MB vs X28C64GI-20
AM9864-2LI EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM9864-2LI
28C64B-20/K 8K X 8 EEPROM 5V, 200 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc P5C164X200L32MB vs 28C64B-20/K
PYA28C64X-20LM EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 Pyramid Semiconductor Corporation P5C164X200L32MB vs PYA28C64X-20LM
AM2864BE-200/BUA EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X200L32MB vs AM2864BE-200/BUA

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