Part Details for P4C164-35DWI by Pyramid Semiconductor Corporation
Overview of P4C164-35DWI by Pyramid Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for P4C164-35DWI
P4C164-35DWI CAD Models
P4C164-35DWI Part Data Attributes
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P4C164-35DWI
Pyramid Semiconductor Corporation
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Datasheet
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P4C164-35DWI
Pyramid Semiconductor Corporation
Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
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Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | PYRAMID SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 35 ns | |
Additional Feature | LG-MAX | |
JESD-30 Code | R-CDIP-T28 | |
Length | 37.846 mm | |
Memory Density | 65536 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 0.15 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |
Alternate Parts for P4C164-35DWI
This table gives cross-reference parts and alternative options found for P4C164-35DWI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C164-35DWI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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7164S35TCB | Standard SRAM, 8KX8, 35ns, CMOS, CDIP28 | Integrated Device Technology Inc | P4C164-35DWI vs 7164S35TCB |
FT6164-35CMBLF | Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 | Force Technologies Ltd | P4C164-35DWI vs FT6164-35CMBLF |
5962-3829413MXX | Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-35DWI vs 5962-3829413MXX |
P4C164L-35DWMB | Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-35DWI vs P4C164L-35DWMB |
3829415BZA | Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Micross Components | P4C164-35DWI vs 3829415BZA |
P4C164L-35P6MBLF | Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-35DWI vs P4C164L-35P6MBLF |
P4C164L-35DI | Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-35DWI vs P4C164L-35DI |
5962-3829413MXA | Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | P4C164-35DWI vs 5962-3829413MXA |
FT6164-35PCLF | Standard SRAM, | Force Technologies Ltd | P4C164-35DWI vs FT6164-35PCLF |
FT6264L-35DM | Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Force Technologies Ltd | P4C164-35DWI vs FT6264L-35DM |