P4C164-35DWI vs 5962-9318703H5C feature comparison

P4C164-35DWI Pyramid Semiconductor Corporation

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5962-9318703H5C White Microelectronics

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP WHITE MICROELECTRONICS
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 85 ns
Additional Feature LG-MAX USER CONFIGURABLE AS 128K X 32 OR 256K X 16
JESD-30 Code R-CDIP-T28 S-CHIP-P66
Length 37.846 mm
Memory Density 65536 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 66
Number of Words 8192 words 524288 words
Number of Words Code 8000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position DUAL HEX
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm
Base Number Matches 2 1
JESD-609 Code e4
Qualification Status Not Qualified
Screening Level MIL-PRF-38535
Terminal Finish GOLD

Compare P4C164-35DWI with alternatives

Compare 5962-9318703H5C with alternatives