Datasheets
P4C164-25DWM by: Pyramid Semiconductor Corporation

Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28

Part Details for P4C164-25DWM by Pyramid Semiconductor Corporation

Overview of P4C164-25DWM by Pyramid Semiconductor Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for P4C164-25DWM

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P4C164-25DWM Part Data Attributes

P4C164-25DWM Pyramid Semiconductor Corporation
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P4C164-25DWM Pyramid Semiconductor Corporation Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns
Additional Feature LG-MAX
I/O Type COMMON
JESD-30 Code R-CDIP-T28
JESD-609 Code e0
Length 37.846 mm
Memory Density 65536 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.155 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for P4C164-25DWM

This table gives cross-reference parts and alternative options found for P4C164-25DWM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C164-25DWM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
P4C164L-25CWI Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C164L-25CWI
P4C164L-25DWC Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C164L-25DWC
5962-3829415MZA Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs 5962-3829415MZA
FT6264-25CMBLF Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Force Technologies Ltd P4C164-25DWM vs FT6264-25CMBLF
5962-3829415MZA Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor P4C164-25DWM vs 5962-3829415MZA
5962-3829415MZC Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Integrated Device Technology Inc P4C164-25DWM vs 5962-3829415MZC
P4C164-25P6MB Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C164-25P6MB
P4C164L-25CWILF Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C164L-25CWILF
5962-3829415MXA 5.0V 8K x 8 Asynchronous Static RAM, CDIP13/Tube Renesas Electronics Corporation P4C164-25DWM vs 5962-3829415MXA
P4C164L-25CWM Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C164L-25CWM
Part Number Description Manufacturer Compare
FTS128K32N-25H3C Standard SRAM, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 Force Technologies Ltd P4C164-25DWM vs FTS128K32N-25H3C
5962-8685911XA Standard SRAM, 16KX4, 70ns, CMOS, CQCC28, LCC-28 Integrated Device Technology Inc P4C164-25DWM vs 5962-8685911XA
P4C1256L-70PMBLF Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C1256L-70PMBLF
P4C164-25DM Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C164-25DM
P4C164L-25CWMBLF Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs P4C164L-25CWMBLF
AS8S128K32PN-20/883C SRAM Module, 128KX32, 20ns, CMOS, CPGA66, PGA-66 Micross Components P4C164-25DWM vs AS8S128K32PN-20/883C
CY7C166A-45DMB Standard SRAM, 16KX4, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Rochester Electronics LLC P4C164-25DWM vs CY7C166A-45DMB
5962-3829463MMA Standard SRAM, 8KX8, 45ns, CMOS, CDFP28, FP-28 Pyramid Semiconductor Corporation P4C164-25DWM vs 5962-3829463MMA
5962-3829407MYX Standard SRAM, 8KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 Electronic Designs Inc P4C164-25DWM vs 5962-3829407MYX
5962-8552511YC Standard SRAM, 8KX8, 70ns, CMOS, Electronic Designs Inc P4C164-25DWM vs 5962-8552511YC

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