Part Details for P4C164-12DM by Pyramid Semiconductor Corporation
Overview of P4C164-12DM by Pyramid Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| PAL22V10-12DM/BV | Rochester Electronics | PAL22V10 - 24 Pin TTL/CMOS Versatile PAL Device | |
| X28C512DM-15 | Rochester Electronics LLC | EEPROM, 64KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 | |
| X28C512DM-15/B | Rochester Electronics LLC | X28C512 - EEPROM, 64KX8, Parallel, CMOS |
Part Details for P4C164-12DM
P4C164-12DM CAD Models
P4C164-12DM Part Data Attributes
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P4C164-12DM
Pyramid Semiconductor Corporation
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Datasheet
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P4C164-12DM
Pyramid Semiconductor Corporation
Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | PYRAMID SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP28,.3 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 12 ns | |
| Additional Feature | LG-MAX | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.719 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Standby Current-Max | 0.025 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.18 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for P4C164-12DM
This table gives cross-reference parts and alternative options found for P4C164-12DM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C164-12DM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-3829447MZA | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Micross Components | P4C164-12DM vs 5962-3829447MZA |
| 5962-3829447MZA | SRAM, 8KX8, 12ns, CMOS, CDIP28, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-12DM vs 5962-3829447MZA |
| P4C164-12PM | Standard SRAM, 8KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-12DM vs P4C164-12PM |
| FT6264-12CMB | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28 | Force Technologies Ltd | P4C164-12DM vs FT6264-12CMB |
| P4C164-12DI | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-12DM vs P4C164-12DI |
| P4C164-12DILF | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-12DM vs P4C164-12DILF |
| FT6264-12DMLF | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 | Force Technologies Ltd | P4C164-12DM vs FT6264-12DMLF |
| P4C164-12DC | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-12DM vs P4C164-12DC |
| P4C164-12DMLF | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | P4C164-12DM vs P4C164-12DMLF |
| FT6264-12DM | Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Force Technologies Ltd | P4C164-12DM vs FT6264-12DM |