Part Details for P4C116-20CMB by Pyramid Semiconductor Corporation
Overview of P4C116-20CMB by Pyramid Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Environmental Monitoring
Space Technology
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Medical Imaging
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Electronic Manufacturing
Communication and Networking
Robotics and Drones
Part Details for P4C116-20CMB
P4C116-20CMB CAD Models
P4C116-20CMB Part Data Attributes
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P4C116-20CMB
Pyramid Semiconductor Corporation
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Datasheet
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P4C116-20CMB
Pyramid Semiconductor Corporation
Standard SRAM, 2KX8, 20ns, CMOS, CDIP24, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-24
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | PYRAMID SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 20 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 32.512 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 7.62 mm | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.155 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for P4C116-20CMB
This table gives cross-reference parts and alternative options found for P4C116-20CMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C116-20CMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 6116SA20TD | Standard SRAM, 2KX8, 19ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Integrated Device Technology Inc | P4C116-20CMB vs 6116SA20TD |
| 6116LA20TP | Standard SRAM, 2KX8, 19ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Integrated Device Technology Inc | P4C116-20CMB vs 6116LA20TP |
| P4C116-20PI | Standard SRAM, 2KX8, 20ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Pyramid Semiconductor Corporation | P4C116-20CMB vs P4C116-20PI |
| 5962-8969002LX | Standard SRAM, 2KX8, 20ns, CMOS, 1.280 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-24 | Cypress Semiconductor | P4C116-20CMB vs 5962-8969002LX |
| 6116LA20TD | Standard SRAM, 2KX8, 19ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Integrated Device Technology Inc | P4C116-20CMB vs 6116LA20TD |
| CY7C128A-20DMB | Standard SRAM, 2KX8, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Cypress Semiconductor | P4C116-20CMB vs CY7C128A-20DMB |
| L6116DMB20 | Standard SRAM, 2KX8, 20ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24 | LOGIC Devices Inc | P4C116-20CMB vs L6116DMB20 |
| P4C116-20DM | Standard SRAM, 2KX8, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Pyramid Semiconductor Corporation | P4C116-20CMB vs P4C116-20DM |
| 5962-8969002LA | Standard SRAM, 2KX8, 20ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | P4C116-20CMB vs 5962-8969002LA |
| 5962-8969002LC | Standard SRAM, 2KX8, 20ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | P4C116-20CMB vs 5962-8969002LC |