Datasheets
NMC27C512Q350 by:

IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC

Part Details for NMC27C512Q350 by National Semiconductor Corporation

Overview of NMC27C512Q350 by National Semiconductor Corporation

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for NMC27C512Q350

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NMC27C512Q350 Part Data Attributes

NMC27C512Q350 National Semiconductor Corporation
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NMC27C512Q350 National Semiconductor Corporation IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP28,.6
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 350 ns
I/O Type COMMON
JESD-30 Code R-XDIP-T28
JESD-609 Code e0
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.02 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for NMC27C512Q350

This table gives cross-reference parts and alternative options found for NMC27C512Q350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C512Q350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
D27512-200V05 UVPROM Rochester Electronics LLC NMC27C512Q350 vs D27512-200V05
NMC27C512QE250 UVPROM Rochester Electronics LLC NMC27C512Q350 vs NMC27C512QE250
D27C512-150V10 UVPROM Rochester Electronics LLC NMC27C512Q350 vs D27C512-150V10
D27512-250V05 UVPROM Rochester Electronics LLC NMC27C512Q350 vs D27512-250V05
WS27C512F-12DMB UVPROM, 64KX8, 120ns, CMOS, CDIP28, Waferscale Integration Inc NMC27C512Q350 vs WS27C512F-12DMB
NMC27C512QM350 UVPROM Rochester Electronics LLC NMC27C512Q350 vs NMC27C512QM350
WS27C512L-15DMB UVPROM, 64KX8, 150ns, CMOS, CDIP28, Waferscale Integration Inc NMC27C512Q350 vs WS27C512L-15DMB
WS27C512L-15TMB UVPROM, 64KX8, 150ns, CMOS, CDIP28, Waferscale Integration Inc NMC27C512Q350 vs WS27C512L-15TMB
MD27512-25 UVPROM Rochester Electronics LLC NMC27C512Q350 vs MD27512-25
D27512 UVPROM Rochester Electronics LLC NMC27C512Q350 vs D27512

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