Datasheets
NMC27C512AQM200 by:

IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM

Part Details for NMC27C512AQM200 by National Semiconductor Corporation

Overview of NMC27C512AQM200 by National Semiconductor Corporation

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for NMC27C512AQM200

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NMC27C512AQM200 Part Data Attributes

NMC27C512AQM200 National Semiconductor Corporation
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NMC27C512AQM200 National Semiconductor Corporation IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description WDIP, DIP28,.6
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class C
Seated Height-Max 5.715 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for NMC27C512AQM200

This table gives cross-reference parts and alternative options found for NMC27C512AQM200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C512AQM200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C512L-200DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C512AQM200 vs AM27C512L-200DI
MBM27C512-20WZ UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 FUJITSU Semiconductor Limited NMC27C512AQM200 vs MBM27C512-20WZ
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion NMC27C512AQM200 vs AM27C512-200DC
SMJ27C512-20J 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, WINDOWED, CERAMIC, DIP-28 Texas Instruments NMC27C512AQM200 vs SMJ27C512-20J
UPD27C512D-20 UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 NEC Electronics Group NMC27C512AQM200 vs UPD27C512D-20
MSM27512-20AS UVPROM, 64KX8, 200ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 OKI Electric Industry Co Ltd NMC27C512AQM200 vs MSM27512-20AS
AM27C512L-200DCB UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C512AQM200 vs AM27C512L-200DCB
M27512-20F1 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics NMC27C512AQM200 vs M27512-20F1
TMS27C512-20JE 524 288-Bit Programmable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments NMC27C512AQM200 vs TMS27C512-20JE
AM27C512-200/BXA UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C512AQM200 vs AM27C512-200/BXA
Part Number Description Manufacturer Compare
TMS27C512-2JL4 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Texas Instruments NMC27C512AQM200 vs TMS27C512-2JL4
NM27P512Q200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NMC27C512AQM200 vs NM27P512Q200
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation NMC27C512AQM200 vs TD27C513-200V10
NM27P512QM200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NMC27C512AQM200 vs NM27P512QM200
SMJ27C512-20J 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, WINDOWED, CERAMIC, DIP-28 Texas Instruments NMC27C512AQM200 vs SMJ27C512-20J
M27C512-20F3 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics NMC27C512AQM200 vs M27C512-20F3
27C512/BXA-20 UVPROM, 64KX8, 200ns, CMOS, CDIP28 YAGEO Corporation NMC27C512AQM200 vs 27C512/BXA-20
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion NMC27C512AQM200 vs AM27C512-200DC
M27C512-20F1L 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics NMC27C512AQM200 vs M27C512-20F1L
TMM27512AD-200 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components NMC27C512AQM200 vs TMM27512AD-200

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