Part Details for NAND08GR4B2CN1E by Micron Technology Inc
Overview of NAND08GR4B2CN1E by Micron Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for NAND08GR4B2CN1E
NAND08GR4B2CN1E CAD Models
NAND08GR4B2CN1E Part Data Attributes
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NAND08GR4B2CN1E
Micron Technology Inc
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Datasheet
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NAND08GR4B2CN1E
Micron Technology Inc
Flash, 1MX8, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | TSOP | |
Package Description | TSSOP, | |
Pin Count | 48 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
JESD-30 Code | R-PDSO-G48 | |
JESD-609 Code | e3 | |
Length | 18.4 mm | |
Memory Density | 8388608 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 1.8 V | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 12 mm |
Alternate Parts for NAND08GR4B2CN1E
This table gives cross-reference parts and alternative options found for NAND08GR4B2CN1E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NAND08GR4B2CN1E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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NAND04GR3B2DN1E | 512KX8 FLASH 1.8V PROM, 30ns, PDSO48, 12 X 20 MM, PLASTIC, ROHS COMPLIANT, TSOP-48 | STMicroelectronics | NAND08GR4B2CN1E vs NAND04GR3B2DN1E |
NAND08GR4B2CN6E | Flash, 512MX8, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 | Numonyx Memory Solutions | NAND08GR4B2CN1E vs NAND08GR4B2CN6E |
NAND04GR3B2DN6E | 512MX8 FLASH 1.8V PROM, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 | Numonyx Memory Solutions | NAND08GR4B2CN1E vs NAND04GR3B2DN6E |
NAND08GR4B2CN1F | Flash, 512MX8, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 | Numonyx Memory Solutions | NAND08GR4B2CN1E vs NAND08GR4B2CN1F |
NAND08GR4B2CN1F | Flash, 1MX8, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 | Micron Technology Inc | NAND08GR4B2CN1E vs NAND08GR4B2CN1F |
NAND04GR3B2DN1F | Flash, 512MX8, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 | Numonyx Memory Solutions | NAND08GR4B2CN1E vs NAND04GR3B2DN1F |