Part Details for N82S130N by NXP Semiconductors
Overview of N82S130N by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Part Details for N82S130N
N82S130N CAD Models
N82S130N Part Data Attributes
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N82S130N
NXP Semiconductors
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Datasheet
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N82S130N
NXP Semiconductors
IC 512 X 4 OTPROM, 50 ns, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Programmable ROM
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | DIP | |
Package Description | 0.300 INCH, PLASTIC, DIP-16 | |
Pin Count | 16 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 50 ns | |
JESD-30 Code | R-PDIP-T16 | |
JESD-609 Code | e0 | |
Memory Density | 2048 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Number of Words | 512 words | |
Number of Words Code | 512 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | ||
Organization | 512X4 | |
Output Characteristics | OPEN-COLLECTOR | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.14 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for N82S130N
This table gives cross-reference parts and alternative options found for N82S130N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of N82S130N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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N82S130F | OTP ROM, 512X4, 50ns, Bipolar, CDIP16 | Signetics | N82S130N vs N82S130F |
N82S130N | OTP ROM, 512X4, 50ns, TTL, PDIP16, | Philips Semiconductors | N82S130N vs N82S130N |
DM54S571BJ | 512X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16 | Texas Instruments | N82S130N vs DM54S571BJ |
N82S131NB | IC 512 X 4 OTPROM, 50 ns, PDIP16, Programmable ROM | NXP Semiconductors | N82S130N vs N82S131NB |
N82S131F | OTP ROM, 512X4, 50ns, Bipolar, CDIP16 | Signetics | N82S130N vs N82S131F |
N82S130F | OTP ROM, 512X4, 50ns, TTL, CDIP16, | Philips Semiconductors | N82S130N vs N82S130F |
N82S231F | 512X4 OTPROM, 50ns, CDIP16 | Philips Semiconductors | N82S130N vs N82S231F |
DM54S571BJ | IC 512 X 4 OTPROM, 50 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM | National Semiconductor Corporation | N82S130N vs DM54S571BJ |
N82S130F | IC 512 X 4 OTPROM, 50 ns, CDIP16, Programmable ROM | NXP Semiconductors | N82S130N vs N82S130F |
N82S230F | OTP ROM, 512X4, 50ns, Bipolar, CDIP16 | Signetics | N82S130N vs N82S230F |