Datasheets
N82S130N by:

IC 512 X 4 OTPROM, 50 ns, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Programmable ROM

Part Details for N82S130N by NXP Semiconductors

Overview of N82S130N by NXP Semiconductors

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage Aerospace and Defense

Part Details for N82S130N

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N82S130N Part Data Attributes

N82S130N NXP Semiconductors
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N82S130N NXP Semiconductors IC 512 X 4 OTPROM, 50 ns, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Programmable ROM
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-16
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 50 ns
JESD-30 Code R-PDIP-T16
JESD-609 Code e0
Memory Density 2048 bit
Memory IC Type OTP ROM
Memory Width 4
Number of Functions 1
Number of Terminals 16
Number of Words 512 words
Number of Words Code 512
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 512X4
Output Characteristics OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for N82S130N

This table gives cross-reference parts and alternative options found for N82S130N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of N82S130N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
N82S130F OTP ROM, 512X4, 50ns, Bipolar, CDIP16 Signetics N82S130N vs N82S130F
N82S130N OTP ROM, 512X4, 50ns, TTL, PDIP16, Philips Semiconductors N82S130N vs N82S130N
DM54S571BJ 512X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16 Texas Instruments N82S130N vs DM54S571BJ
N82S131NB IC 512 X 4 OTPROM, 50 ns, PDIP16, Programmable ROM NXP Semiconductors N82S130N vs N82S131NB
N82S131F OTP ROM, 512X4, 50ns, Bipolar, CDIP16 Signetics N82S130N vs N82S131F
N82S130F OTP ROM, 512X4, 50ns, TTL, CDIP16, Philips Semiconductors N82S130N vs N82S130F
N82S231F 512X4 OTPROM, 50ns, CDIP16 Philips Semiconductors N82S130N vs N82S231F
DM54S571BJ IC 512 X 4 OTPROM, 50 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM National Semiconductor Corporation N82S130N vs DM54S571BJ
N82S130F IC 512 X 4 OTPROM, 50 ns, CDIP16, Programmable ROM NXP Semiconductors N82S130N vs N82S130F
N82S230F OTP ROM, 512X4, 50ns, Bipolar, CDIP16 Signetics N82S130N vs N82S230F
Part Number Description Manufacturer Compare
63S240N OTP ROM, 512X4, 45ns, CMOS, PDIP16, Monolithic Memories (RETIRED) N82S130N vs 63S240N
53S241J OTP ROM, 512X4, 55ns, CMOS, CDIP16, Monolithic Memories (RETIRED) N82S130N vs 53S241J
53S240J883B OTP ROM, 512X4, 55ns, CMOS, CDIP16, Monolithic Memories (RETIRED) N82S130N vs 53S240J883B
AM27S13PCB OTP ROM, 512X4, 50ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD N82S130N vs AM27S13PCB
M38510/20404BEA OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v N82S130N vs M38510/20404BEA
63S241AN OTP ROM, 512X4, 35ns, CMOS, PDIP16, Monolithic Memories (RETIRED) N82S130N vs 63S241AN
M38510/20404BEX OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc N82S130N vs M38510/20404BEX
S82S131F883B OTP ROM, 512X4, 70ns, Bipolar, CDIP16, DIP-16 Signetics N82S130N vs S82S131F883B
53S241AJ883B OTP ROM, 512X4, 45ns, CMOS, CDIP16, Monolithic Memories (RETIRED) N82S130N vs 53S241AJ883B
AM27S12ADCB OTP ROM, 512X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD N82S130N vs AM27S12ADCB

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