Part Details for MX23L1610PC-10G by Macronix International Co Ltd
Overview of MX23L1610PC-10G by Macronix International Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| RJMG301T244E3ER | Amphenol Communications Solutions | RJMG 1x1 10G RightAngle | |
| XGXP-1396-10D | Amphenol Communications Solutions | 10G SFP+ 1310nm LR | |
| XPBL-495596-80D | Amphenol Communications Solutions | 10G BIDI SFP+ ZR |
Part Details for MX23L1610PC-10G
MX23L1610PC-10G CAD Models
MX23L1610PC-10G Part Data Attributes
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MX23L1610PC-10G
Macronix International Co Ltd
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Datasheet
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MX23L1610PC-10G
Macronix International Co Ltd
MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, LEAD FREE, PLASTIC, DIP-42
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MACRONIX INTERNATIONAL CO LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP42,.6 | |
| Pin Count | 42 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 100 ns | |
| Alternate Memory Width | 8 | |
| JESD-30 Code | R-PDIP-T42 | |
| Length | 51.94 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 42 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP42,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.9 mm | |
| Standby Current-Max | 0.000015 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for MX23L1610PC-10G
This table gives cross-reference parts and alternative options found for MX23L1610PC-10G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MX23L1610PC-10G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K3P5V1000F-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L1610PC-10G vs K3P5V1000F-DC100 |
| K3P5U1000D-DC10 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L1610PC-10G vs K3P5U1000D-DC10 |
| K3N5V1000E-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L1610PC-10G vs K3N5V1000E-DC100 |
| MR27V1652E-XXRA | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | OKI Electric Industry Co Ltd | MX23L1610PC-10G vs MR27V1652E-XXRA |
| K3N5U1000D-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L1610PC-10G vs K3N5U1000D-DC100 |
| K3N5V1000F-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L1610PC-10G vs K3N5V1000F-DC100 |
| KM23V16000D-10 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L1610PC-10G vs KM23V16000D-10 |
| KM23V16005D-10 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | MX23L1610PC-10G vs KM23V16005D-10 |
| MR27V1652E-XXRA | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | LAPIS Semiconductor Co Ltd | MX23L1610PC-10G vs MR27V1652E-XXRA |