Part Details for MX23C4100MC-10 by Macronix International Co Ltd
Overview of MX23C4100MC-10 by Macronix International Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
Part Details for MX23C4100MC-10
MX23C4100MC-10 CAD Models
MX23C4100MC-10 Part Data Attributes
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MX23C4100MC-10
Macronix International Co Ltd
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Datasheet
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MX23C4100MC-10
Macronix International Co Ltd
MASK ROM, 256KX16, 100ns, CMOS, PDSO40, 0.450 INCH, MO-099, SOP-40
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MACRONIX INTERNATIONAL CO LTD | |
Part Package Code | SOIC | |
Package Description | SOP, | |
Pin Count | 40 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 150 ns | |
Additional Feature | CAN ALSO BE CONFIGURED AS 256K X 16 | |
Alternate Memory Width | 8 | |
JESD-30 Code | R-PDSO-G40 | |
Length | 26.06 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | MASK ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 40 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3 mm | |
Supply Current-Max | 0.05 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 11.3 mm |
Alternate Parts for MX23C4100MC-10
This table gives cross-reference parts and alternative options found for MX23C4100MC-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MX23C4100MC-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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K3N3C1000D-GC10 | MASK ROM, 256KX16, 100ns, CMOS, PDSO40, 0.525 INCH, SOP-40 | Samsung Semiconductor | MX23C4100MC-10 vs K3N3C1000D-GC10 |
HN62454NFA-10 | MASK ROM, 256KX16, 100ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 | Hitachi Ltd | MX23C4100MC-10 vs HN62454NFA-10 |
LH534096N | MASK ROM, 256KX16, 100ns, CMOS, PDSO40, SOP-40 | Sharp Corp | MX23C4100MC-10 vs LH534096N |
HN62454FA-10 | MASK ROM, 256KX16, 100ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 | Hitachi Ltd | MX23C4100MC-10 vs HN62454FA-10 |