There are no models available for this part yet.
Overview of MPC860DPZQ50D4R2 by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
CAD Models for MPC860DPZQ50D4R2 by Freescale Semiconductor
Part Data Attributes for MPC860DPZQ50D4R2 by Freescale Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code
|
BGA
|
Package Description
|
BGA, BGA357,19X19,50
|
Pin Count
|
357
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
5A991
|
HTS Code
|
8542.31.00.01
|
Address Bus Width
|
32
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
50 MHz
|
External Data Bus Width
|
32
|
Format
|
FIXED POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B357
|
JESD-609 Code
|
e0
|
Length
|
25 mm
|
Low Power Mode
|
YES
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
357
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA357,19X19,50
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
245
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.52 mm
|
Speed
|
50 MHz
|
Supply Voltage-Max
|
3.465 V
|
Supply Voltage-Min
|
3.135 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
25 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for MPC860DPZQ50D4R2
This table gives cross-reference parts and alternative options found for MPC860DPZQ50D4R2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC860DPZQ50D4R2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MPC860DPZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | MPC860DPZQ50D4R2 vs MPC860DPZQ50D4 |
TSPC860SRMZP50D | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | MPC860DPZQ50D4R2 vs TSPC860SRMZP50D |
MPC860SRCZP50D4 | MPC860SRCZP50D4 | Motorola Semiconductor Products | MPC860DPZQ50D4R2 vs MPC860SRCZP50D4 |
KMPC855TZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DPZQ50D4R2 vs KMPC855TZQ50D4 |
MPC860SRZQ50D4R2 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DPZQ50D4R2 vs MPC860SRZQ50D4R2 |
MPC860PCZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | MPC860DPZQ50D4R2 vs MPC860PCZQ50D4 |
XPC860DPZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | MPC860DPZQ50D4R2 vs XPC860DPZP50D4 |
XPC857TZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DPZQ50D4R2 vs XPC857TZP50B |
XPC860PZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DPZQ50D4R2 vs XPC860PZP50D3 |
MPC855TCZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DPZQ50D4R2 vs MPC855TCZQ50D4 |