Part Details for XPC860PZP50D3 by Freescale Semiconductor
Overview of XPC860PZP50D3 by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XPC860PZP50D3
XPC860PZP50D3 CAD Models
XPC860PZP50D3 Part Data Attributes
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XPC860PZP50D3
Freescale Semiconductor
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Datasheet
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XPC860PZP50D3
Freescale Semiconductor
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA357,19X19,50 | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A991 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC860PZP50D3
This table gives cross-reference parts and alternative options found for XPC860PZP50D3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860PZP50D3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC860DPZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860PZP50D3 vs MPC860DPZQ50D4 |
| TSPC860MHVZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860PZP50D3 vs TSPC860MHVZPU50B |
| MPC860DEZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860PZP50D3 vs MPC860DEZQ50D4 |
| MPC860PCZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860PZP50D3 vs MPC860PCZQ50D4 |
| MPC860ENZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, PCMCIA, 0 to 95C | Freescale Semiconductor | XPC860PZP50D3 vs MPC860ENZQ50D4 |
| MPC860TZQ50D4R2 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860PZP50D3 vs MPC860TZQ50D4R2 |
| TSXPC860MHVZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860PZP50D3 vs TSXPC860MHVZPU50B |
| MPC860SRVR50D4R2 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860PZP50D3 vs MPC860SRVR50D4R2 |
| MPC860TCVR50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860PZP50D3 vs MPC860TCVR50D4 |
| XPC862DPZP50 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860PZP50D3 vs XPC862DPZP50 |