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Overview of MM52116D by National Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Industrial Automation
Financial Technology (Fintech)
Energy and Power Systems
Renewable Energy
Automotive
CAD Models for MM52116D by National Semiconductor Corporation
Part Data Attributes for MM52116D by National Semiconductor Corporation
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|
|
|---|---|
|
Rohs Code
|
No
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|
Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
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|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.71
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|
Access Time-Max
|
200 ns
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|
JESD-30 Code
|
R-XDIP-T24
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|
JESD-609 Code
|
e0
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Memory Density
|
8388608 bit
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Memory IC Type
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MASK ROM
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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24
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Number of Words
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2048 words
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Number of Words Code
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2000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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|
Operating Temperature-Min
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|
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Organization
|
1MX8
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Package Body Material
|
CERAMIC
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Package Code
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DIP
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Package Equivalence Code
|
DIP24,.6
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
|
PARALLEL
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|
Qualification Status
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Not Qualified
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
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|
Supply Voltage-Min (Vsup)
|
4.5 V
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|
Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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Technology
|
MOS
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Temperature Grade
|
COMMERCIAL
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Terminal Finish
|
Tin/Lead (Sn/Pb)
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Terminal Form
|
THROUGH-HOLE
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Terminal Pitch
|
2.54 mm
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|
Terminal Position
|
DUAL
|