Datasheets
MCM511000AP10 by:

IC,DRAM,FAST PAGE,1MX1,CMOS,DIP,18PIN,PLASTIC

Part Details for MCM511000AP10 by Freescale Semiconductor

Overview of MCM511000AP10 by Freescale Semiconductor

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Part Details for MCM511000AP10

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MCM511000AP10 Part Data Attributes

MCM511000AP10 Freescale Semiconductor
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MCM511000AP10 Freescale Semiconductor IC,DRAM,FAST PAGE,1MX1,CMOS,DIP,18PIN,PLASTIC
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description DIP, DIP18,.3
Reach Compliance Code unknown
Access Time-Max 100 ns
I/O Type SEPARATE
JESD-30 Code R-PDIP-T18
JESD-609 Code e0
Memory Density 1048576 bit
Memory IC Type FAST PAGE DRAM
Memory Width 1
Number of Terminals 18
Number of Words 1048576 words
Number of Words Code 1000000
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Power Supplies 5 V
Qualification Status Not Qualified
Refresh Cycles 512
Standby Current-Max 0.001 A
Supply Current-Max 0.06 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

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