There are no models available for this part yet.
Overview of MBJCS31QHB7472KTPA18 by TAIYO YUDEN
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 5 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for MBJCS31QHB7472KTPA18 by TAIYO YUDEN
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
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DISTI #
587-MBJCS31QHB7472KTPA18TR-ND
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DigiKey | CAP CER 4700PF 630V X7R 1206 Min Qty: 3000 Lead time: 11 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
$0.2007 | Buy Now | |
|
DISTI #
MBJCS31QHB7472KTPA
|
Avnet Americas | MLCC, 1206, 630V, X7R, 4700PF 10%, T&R - Tape and Reel (Alt: MBJCS31QHB7472KTPA) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Container: Reel | 0 |
|
$0.2094 / $0.2359 | Buy Now | |
|
DISTI #
963-MBJCS31QHB7472KT
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Mouser Electronics | Multilayer Ceramic Capacitors MLCC - SMD/SMT 630V 4700pF X7R 1206 10% Industrial RoHS: Compliant | 0 |
|
$0.1700 / $0.6400 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 3000 Package Multiple: 3000 Lead time: 10 Weeks | 0 |
|
$0.1767 | Buy Now | ||
| Onlinecomponents.com | RoHS: Compliant | 0 |
|
$0.1937 / $0.2185 | Buy Now |
CAD Models for MBJCS31QHB7472KTPA18 by TAIYO YUDEN
Part Data Attributes for MBJCS31QHB7472KTPA18 by TAIYO YUDEN
|
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|
|---|---|
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Rohs Code
|
Yes
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Part Life Cycle Code
|
Active
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Ihs Manufacturer
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TAIYO YUDEN CO LTD
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Package Description
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CHIP
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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HTS Code
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8532.24.00.20
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Capacitance
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0.0047 µF
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Capacitor Type
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CERAMIC CAPACITOR
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Dielectric Material
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CERAMIC
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Height
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1.15 mm
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Length
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3.2 mm
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Mounting Feature
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SURFACE MOUNT
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Multilayer
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Yes
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Negative Tolerance
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10%
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Number of Terminals
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2
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Package Shape
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RECTANGULAR PACKAGE
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Package Style
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SMT
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Packing Method
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TR, EMBOSSED, 7 INCH
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Positive Tolerance
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10%
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Rated (DC) Voltage (URdc)
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630 V
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Size Code
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1206
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Surface Mount
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YES
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Temperature Characteristics Code
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X7R
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Temperature Coefficient
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15% ppm/°C
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Terminal Shape
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WRAPAROUND
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Width
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1.6 mm
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Alternate Parts for MBJCS31QHB7472KTPA18
This table gives cross-reference parts and alternative options found for MBJCS31QHB7472KTPA18. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBJCS31QHB7472KTPA18, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBASS31QHB7472KTNA01 | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MBASS31QHB7472KTNA01 |
| MMASS31QHB7472KTNA01 | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MMASS31QHB7472KTNA01 |
| CGA5H4X7R2J472KT | Ceramic Capacitor, Multilayer, Ceramic, 630V, X7R, -/+15ppm/Cel TC, 0.0047uF, 1206 | TDK Corporation | MBJCS31QHB7472KTPA18 vs CGA5H4X7R2J472KT |
| MMJCS31QHB7472KTPA18 | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MMJCS31QHB7472KTPA18 |
| MCJCS31QHB7472KTPA1J | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MCJCS31QHB7472KTPA1J |
| MBASS31QHB7472KTNA18 | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MBASS31QHB7472KTNA18 |
| MMJCS31QHB7472KTPA01 | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MMJCS31QHB7472KTPA01 |
| MCJCS31QHB7472KTPA01 | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MCJCS31QHB7472KTPA01 |
| CGA5H4X7R2J472K | CAPACITOR, CERAMIC | TDK Corporation | MBJCS31QHB7472KTPA18 vs CGA5H4X7R2J472K |
| MSASS31QHB7472KTNA01 | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0047uF, Surface Mount, 1206, CHIP | TAIYO YUDEN | MBJCS31QHB7472KTPA18 vs MSASS31QHB7472KTNA01 |