Part Details for MB96F313ASBPMC-GSE2 by FUJITSU Semiconductor Limited
Overview of MB96F313ASBPMC-GSE2 by FUJITSU Semiconductor Limited
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
UPD16823GS-E2-A | Renesas Electronics Corporation | Protected and Intelligent Power Switches, , / | |
UPD16808GS-E2-A | Renesas Electronics Corporation | Protected and Intelligent Power Switches, , / |
Part Details for MB96F313ASBPMC-GSE2
MB96F313ASBPMC-GSE2 CAD Models
MB96F313ASBPMC-GSE2 Part Data Attributes
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MB96F313ASBPMC-GSE2
FUJITSU Semiconductor Limited
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Datasheet
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MB96F313ASBPMC-GSE2
FUJITSU Semiconductor Limited
16-BIT, FLASH, 56MHz, MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-48
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FUJITSU LTD | |
Part Package Code | QFP | |
Package Description | LFQFP, QFP48,.35SQ,20 | |
Pin Count | 48 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
CPU Family | F2MC-16F | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G48 | |
Length | 7 mm | |
Number of I/O Lines | 36 | |
Number of Terminals | 48 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP48,.35SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
RAM (bytes) | 8192 | |
ROM (words) | 98304 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.7 mm | |
Speed | 56 MHz | |
Supply Current-Max | 60 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |