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MB89R112B1QN-G-AMEFE1 by:

SPECIALTY MEMORY CIRCUIT, PQCC24, 4 X 4 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFN-24

Part Details for MB89R112B1QN-G-AMEFE1 by FUJITSU Semiconductor Limited

Overview of MB89R112B1QN-G-AMEFE1 by FUJITSU Semiconductor Limited

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Applications Industrial Automation Renewable Energy Robotics and Drones

Part Details for MB89R112B1QN-G-AMEFE1

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MB89R112B1QN-G-AMEFE1 Part Data Attributes:

MB89R112B1QN-G-AMEFE1 FUJITSU Semiconductor Limited
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MB89R112B1QN-G-AMEFE1 FUJITSU Semiconductor Limited SPECIALTY MEMORY CIRCUIT, PQCC24, 4 X 4 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFN-24
Rohs Code Yes
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer FUJITSU LTD
Part Package Code QFN
Package Description HVQCCN,
Pin Count 24
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Additional Feature DATA RETENTION TIME @ 85 DEGREE CENTIGRADE
Clock Frequency-Max (fCLK) 2 MHz
Data Retention Time-Min 10
Endurance 1000000000000 Write/Erase Cycles
JESD-30 Code S-PQCC-N24
Length 4 mm
Memory Density 73728 bit
Memory IC Type FRAM-EMBEDDED
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 9216 words
Number of Words Code 9000
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Organization 9KX8
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC24,.2SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL
Seated Height-Max 0.75 mm
Serial Bus Type SPI
Standby Current-Max 0.000048 A
Standby Voltage-Min 3 V
Supply Current-Max 0.0005 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 4 mm

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