Part Details for MAX3669ETG+ by Rochester Electronics LLC
Overview of MAX3669ETG+ by Rochester Electronics LLC
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Part Details for MAX3669ETG+
MAX3669ETG+ CAD Models
MAX3669ETG+ Part Data Attributes
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MAX3669ETG+
Rochester Electronics LLC
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Datasheet
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MAX3669ETG+
Rochester Electronics LLC
SPECIALTY INTERFACE CIRCUIT, QCC24, 4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220, QFN-24
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Pbfree Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | QFN | |
Package Description | 4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220, QFN-24 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
Interface IC Type | INTERFACE CIRCUIT | |
JESD-30 Code | S-XQCC-N24 | |
JESD-609 Code | e3 | |
Length | 4 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3.14 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 4 mm |