Part Details for MAX3372EEBL+T by Rochester Electronics LLC
Overview of MAX3372EEBL+T by Rochester Electronics LLC
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Part Details for MAX3372EEBL+T
MAX3372EEBL+T CAD Models
MAX3372EEBL+T Part Data Attributes
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MAX3372EEBL+T
Rochester Electronics LLC
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Datasheet
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MAX3372EEBL+T
Rochester Electronics LLC
SPECIALTY INTERFACE CIRCUIT, PBGA9, 1.50 X 1.50 MM, UCSP-9
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Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | BGA | |
Package Description | 1.50 X 1.50 MM, UCSP-9 | |
Pin Count | 9 | |
Reach Compliance Code | unknown | |
Additional Feature | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | |
Interface IC Type | INTERFACE CIRCUIT | |
JESD-30 Code | S-PBGA-B9 | |
JESD-609 Code | e0 | |
Length | 1.52 mm | |
Number of Functions | 2 | |
Number of Terminals | 9 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 0.67 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 1.65 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Width | 1.52 mm |