Part Details for M54730AP-2 by Mitsubishi Electric
Overview of M54730AP-2 by Mitsubishi Electric
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for M54730AP-2
M54730AP-2 CAD Models
M54730AP-2 Part Data Attributes
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M54730AP-2
Mitsubishi Electric
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Datasheet
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M54730AP-2
Mitsubishi Electric
OTP ROM, 32X8, 35ns, Bipolar, PDIP16, PLASTIC, DIP-16
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MITSUBISHI ELECTRIC CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP16,.3 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-PDIP-T16 | |
| JESD-609 Code | e0 | |
| Length | 19 mm | |
| Memory Density | 256 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 32 words | |
| Number of Words Code | 32 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| Organization | 32X8 | |
| Output Characteristics | OPEN-COLLECTOR | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.5 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for M54730AP-2
This table gives cross-reference parts and alternative options found for M54730AP-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M54730AP-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M38510/20703BEA | OTP ROM, 32X8, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Lansdale Semiconductor Inc | M54730AP-2 vs M38510/20703BEA |
| 82S123A/BEA | OTP ROM, 32X8, 35ns, Bipolar, CDIP16, | YAGEO Corporation | M54730AP-2 vs 82S123A/BEA |
| M38510/20704BEX | OTP ROM, 32X8, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Teledyne e2v | M54730AP-2 vs M38510/20704BEX |
| M38510/20704BEA | IC 32 X 8 OTPROM, 35 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM | NXP Semiconductors | M54730AP-2 vs M38510/20704BEA |
| AM27S19A/BEA | OTP ROM, 32X8, 35ns, Bipolar, CDIP16, CERAMIC, DIP-16 | AMD | M54730AP-2 vs AM27S19A/BEA |
| AM27S18A/BEA | OTP ROM, 32X8, 35ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | M54730AP-2 vs AM27S18A/BEA |
| M38510/20703BEA | OTP ROM, 32X8, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Teledyne e2v | M54730AP-2 vs M38510/20703BEA |
| M38510/20704BEX | OTP ROM, 32X8, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Lansdale Semiconductor Inc | M54730AP-2 vs M38510/20704BEX |
| 5962-8670302EX | OTP ROM, 32X8, 35ns, Bipolar, CDIP16, CERAMIC, DIP-16 | Lansdale Semiconductor Inc | M54730AP-2 vs 5962-8670302EX |
| 82S123A/BEA | IC 32 X 8 OTPROM, 35 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | M54730AP-2 vs 82S123A/BEA |