Memory
M54701AP
Mitsubishi Electric
Description: OTP ROM, 256X4, 50ns, Bipolar, PDIP16, PLASTIC, DIP-16

Overview of M54701AP by Mitsubishi Electric

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Part Data Attributes for M54701AP by Mitsubishi Electric

M54701AP
Mitsubishi Electric
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MITSUBISHI ELECTRIC CORP
Part Package Code
DIP
Package Description
DIP,
Pin Count
16
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
50 ns
JESD-30 Code
R-PDIP-T16
Length
19 mm
Memory Density
1024 bit
Memory IC Type
OTP ROM
Memory Width
4
Number of Functions
1
Number of Terminals
16
Number of Words
256 words
Number of Words Code
256
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
75 °C
Operating Temperature-Min
-20 °C
Organization
256X4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
4.5 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
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  1. M54701AP
    Mitsubishi Electric
    OTP ROM, 256X4, 50ns, Bipolar, PDIP16, PLASTIC, DIP-16
    VS

Alternate Parts for M54701AP

This table gives cross-reference parts and alternative options found for M54701AP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M54701AP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
N82S129F OTP ROM, 256X4, 50ns, Bipolar, CDIP16, Signetics M54701AP vs N82S129F
N82S226F IC 256 X 4 OTPROM, 50 ns, CDIP16, Programmable ROM NXP Semiconductors M54701AP vs N82S226F
N82S229B IC 256 X 4 OTPROM, 50 ns, PDIP16, Programmable ROM NXP Semiconductors M54701AP vs N82S229B
N82S126F OTP ROM, 256X4, 50ns, Bipolar, CDIP16, Signetics M54701AP vs N82S126F
N82S126NB OTP ROM, 256X4, 50ns, Bipolar, PDIP16, Signetics M54701AP vs N82S126NB
N82S126B OTP ROM, 256X4, 50ns, Bipolar, PDIP16, Signetics M54701AP vs N82S126B
MB7113LCZ OTP ROM, 256X4, 50ns, Bipolar, CDIP16, CERDIP-16 FUJITSU Semiconductor Limited M54701AP vs MB7113LCZ
N82S226B OTP ROM, 256X4, 50ns, Bipolar, PDIP16, Signetics M54701AP vs N82S226B
MB7114LP OTP ROM, 256X4, 50ns, Bipolar, PDIP16, PLASTIC, DIP-16 FUJITSU Semiconductor Limited M54701AP vs MB7114LP
N82S129F IC 256 X 4 OTPROM, 50 ns, CDIP16, Programmable ROM NXP Semiconductors M54701AP vs N82S129F
Part Number Description Manufacturer Compare
N82S129NB 256X4 OTPROM, 50ns, PDIP16 Philips Semiconductors M54701AP vs N82S129NB
M38510/20302SEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M54701AP vs M38510/20302SEX
M38510/20301BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M54701AP vs M38510/20301BEX
DM74S287AJ 256X4 OTPROM, 30ns, CDIP16, CERAMIC, DIP-16 Texas Instruments M54701AP vs DM74S287AJ
AM27S20/BEA OTP ROM, 256X4, 60ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD M54701AP vs AM27S20/BEA
N82S229F OTP ROM, 256X4, 50ns, Bipolar, CDIP16, Signetics M54701AP vs N82S229F
AM27S21APCB OTP ROM, 256X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD M54701AP vs AM27S21APCB
AM27S21DCB OTP ROM, 256X4, 45ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD M54701AP vs AM27S21DCB
AM27S20ADCB OTP ROM, 256X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD M54701AP vs AM27S20ADCB
N82S126N OTP ROM, 256X4, 50ns, Bipolar, PDIP16, Signetics M54701AP vs N82S126N

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