Part Details for M54700AP-2 by Mitsubishi Electric
Overview of M54700AP-2 by Mitsubishi Electric
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Part Details for M54700AP-2
M54700AP-2 CAD Models
M54700AP-2 Part Data Attributes
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M54700AP-2
Mitsubishi Electric
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Datasheet
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M54700AP-2
Mitsubishi Electric
OTP ROM, 256X4, 35ns, Bipolar, PDIP16, PLASTIC, DIP-16
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MITSUBISHI ELECTRIC CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP16,.3 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-PDIP-T16 | |
| JESD-609 Code | e0 | |
| Length | 19 mm | |
| Memory Density | 1024 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| Organization | 256X4 | |
| Output Characteristics | OPEN-COLLECTOR | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.5 mm | |
| Supply Current-Max | 0.12 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for M54700AP-2
This table gives cross-reference parts and alternative options found for M54700AP-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M54700AP-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M54700AS-2 | OTP ROM, 256X4, 35ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 | Mitsubishi Electric | M54700AP-2 vs M54700AS-2 |
| M38510/20304BEA | OTP ROM, 256X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Teledyne e2v | M54700AP-2 vs M38510/20304BEA |
| M38510/20304BEA | IC 256 X 4 OTPROM, 35 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM | NXP Semiconductors | M54700AP-2 vs M38510/20304BEA |
| M38510/20304BEX | OTP ROM, 256X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Lansdale Semiconductor Inc | M54700AP-2 vs M38510/20304BEX |
| M54701AS-2 | OTP ROM, 256X4, 35ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 | Mitsubishi Electric | M54700AP-2 vs M54701AS-2 |
| M38510/20304BEX | OTP ROM, 256X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Teledyne e2v | M54700AP-2 vs M38510/20304BEX |
| M38510/20303BEX | OTP ROM, 256X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Teledyne e2v | M54700AP-2 vs M38510/20303BEX |
| M38510/20304BEA | OTP ROM, 256X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Lansdale Semiconductor Inc | M54700AP-2 vs M38510/20304BEA |
| 82S129ABEA | OTP ROM, 256X4, 35ns, Bipolar, CDIP16, | Teledyne e2v | M54700AP-2 vs 82S129ABEA |
| M38510/20303BEX | OTP ROM, 256X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Lansdale Semiconductor Inc | M54700AP-2 vs M38510/20303BEX |